The thermal expansion coefficient (TEC) of investigated Pt/C nanoparticles is always superior to that of bulk Pt. When the grain size D decreases from 11 to 3nm, the TEC nonlinearly increases by about 1.66×106K1 which corresponds to a variation of 20% from bulk Pt. The obtained ...
Thermal expansion coefficientResidual stressMagnetic properties of the FePt/Pt bilayers with Pt underlayer were investigated. By introducing the Pt underlayer, coercivity H c and ordering parameter K of the film were enhanced by about of 50%. After a low-temperature annealing process at only 400 ...
Coefficient of thermal expansion ( x10⁻⁶ K⁻¹ )8.700 @20-100℃ Melting point ( C )1800.00 Thermal conductivity ( W m⁻¹ K⁻¹ )31.00 @23 Mechanical Properties(机械性能) Elongation at break ( % )< 25.0 Hardness - Brinell130 - 190 ...
Thermal Properties(热性能) Coefficient of thermal expansion ( x10⁻⁶ K⁻1 )9.000 @0-100 Latent heat of evaporation ( J g⁻1 )2405 Latent heat of fusion ( J g⁻1 )101.00 Melting point ( C )1772.00 Specific heat ( J K⁻1 kg⁻1 )133.0 @025℃ ...
Atomic Weight195.084 Atomic Number78 Color/AppearanceMetallic Gray Thermal Conductivity72 W/m.K Melting Point (°C)1,772 Coefficient of Thermal Expansion8.8 x 10-6/K Theoretical Density (g/cc)21.45 Z Ratio0.245 SputterDC Max Power Density ...
thecomputa— tionoflatticeconstantsandcohesiveenergyareinexcellentagreementwithexperimentalvalue.Itselectronicstructure isinwellagreementwiththeresultsoffirstprinciples.Therelationshipbetweentheelectronicstructureandcatalytic performanceisexplainedqualitatively.Thepotentialcurve,linearthermalexpansioncoefficient,latticeconstants,spe...
4 ThermalProperties NaturalisotopedistributionMassNo.%Coefficientofthermalexpansion@0-100C9.0x10 -6 K -1 1900.01Latentheatofevaporation2405Jg -1 1920.79Latentheatoffusion101Jg -1 19432.90Specificheat@25C133JK -1 kg -1 19533.80Thermalconductivity@0-100C71.6Wm -1 K -1 19625.30 1987.20Mechanical...
of the ICSD card, the reflections of BTO in both structures are shifted to lower 2θvalues, which could be due to the presence of tensile stress, appearing during the cooling after the annealing treatment, due to the thermal expansion coefficient difference between film and substrate21,22....
图2 Fig.2 fcc-Ni(a)、fcc-Pd(b)、fcc-Pt(c)的线热膨系 数α与温度变化关系的理论曲线 Linear thermal expansion coefficient as a func- tion of temperature for fcc-Ni(a), fcc-Pd(b) and fcc-Pt(c) (○ —实验值 [14] ) 4 贵 金 属 第27 卷 2.3 比热 比热对多相热力学平衡计算及...
Coefficient of thermal expansion @20-100C ( x10-6 K-1 )8.7 Thermal conductivity @23C ( W m-1 K-1 )31 Typical Analysis : (ppm) Ag 100, Au 75, Cu 50, Fe 250, Ir 10%, Ni <100, Si <50, Pt. balance. Tolerances Wire diameter: ±10% Length:+5% / -1% Send you...