为了减小损坏层的厚度,人们进行了大量研究,包括降低入射离子束的能量、使用宽离子束 (BIB) 铣削"清洁"FIB 制备的横截面试样或者气体辅助离子刻蚀(Gas-assisted etching,GAE)。 在当前的商用FIB系统中,离子光学系统经过优化,可在20-30kV的电压下工作。如果FIB的入射能量降低...
Bailey G W .Effects of Ion Species and Energy on the Amorphization of Si During FIB TEM Sample Preparation as Determined by Computational and Experimental Methods[J].Microscopy and Microanalysis, 2000 5.1 顶部表面的离子损伤 为防止顶面损伤和 "帷幕效应curtain effect",在开始任何铣削之前,使用FIB仪器在...
图3 特定区域横截面TEM样品制备的FIB前程序示意图 (a) 使用激光束标记感兴趣区域,(b) 将模具横截面磨削至20至75 μm厚度,可使用精密高速锯来实现、 (c) 将切片转移到FIB上进行铣削,或在必要时在样品上粘上一个开槽的3毫米铜半环作为支撑,然后使用FIB铣削感兴趣的区域,以及 (d) 电子透明区域的特写示意图。
Thermo Fisher Scientific has 30+ years of TEM sample preparation expertise. In 1993, we introduced DualBeam (FIB-SEM, focused ion beam – scanning electron microscopy) technology to give you cutting-edge sample preparation tools that are accessible, robust, and reliable. This begins with a highly...
使用DualBeam 仪器进行 TEM 分析的 FIB 样品制备。 用于扫描/透射电子显微镜 (S/TEM) 分析的样品制备仍被认为是材料表征实验室中最关键但又具有挑战性和耗时的任务之一。用于制备 S/TEM 所需的超薄样品的传统方法非常耗时,通常需要经过大量培训的人员付出数小时甚至数天的努力。各种不同的材料以及现场的特定需求使...
1. Sample Collection and Preparation: The first step is to collect and prepare the sample to be imaged. The sample can be a thin film, a powder, or a biological specimen. For thin films, a section of the material is typically cut using a diamond knife or a focused ion beam(FIB). Fo...
内容提示: Philips Semiconductors Nijmegen PMOFIB-TEM sample preparationby in-situ lift-out techniqueHarry Roberts and Bert OtterlooPhilips Semiconductors, PMO department 文档格式:PDF | 页数:24 | 浏览次数:60 | 上传日期:2012-09-03 21:28:18 | 文档星级: ...
FIB制样 粉末/生物样品制样 1、韧性样品离子减薄 A)适用于一般金属样品,韧性好,容易磨样至40~50μm。如铜合金、铝合金、镁合金、钢、铁,等等。 B)若样品较厚或尺寸较大,用电火花线切割或低速锯切取直径>3mm,厚>400μm的样片,再用砂纸将样品双面研磨至约100μm厚。
An improved method of preparing ultra-thin TEM samples that combines backside thinning with an additional cleaning step to remove surface defects on the FIB-facing substrate surface. This additional step results in the creation of a cleaned, uniform "hardmask" that controls the ultimate results of...
The Thermo Scientific ExSolve wafer TEM prep (WTP)DualBeam (FIB-SEM)dramatically reduces the cost and increases the speed of sample preparation, providing semiconductor and data storage manufacturers with quick and easy access to the data they need to verify and monitor process performance. The Ex...