系统单芯片(System on Package；SoP)与系统化封装(System in a Package；SiP)
A package system is provided to reduce a protruded portion compared to a conventional package and to perform a surface mount by connecting directly a first metal line pattern of a first substrate surface of a connection module and a second metal line pattern of a second substrate surface of a...
System in Package solutions for mobile applications Amkor’s System in Package (SiP) is popular with the industry’s demand for higher levels of integration and lower cost. Our SiP technology is an ideal solution in markets that demand a smaller size with increased functionality. We have a ...
SiP(System in Package,系统级封装)是将多种功能芯片,包括处理器、存储器等功能芯片集成在一个封装内,从而实现一个基本完整的功能。SiP与SoC(System on a Chip系统级芯片)相对应,不同的是SiP采用不同芯片并排或叠加的封装方式,而SoC则是高度集成的芯片产品。 SiP与SoC极为相似,两者均将一个包含逻辑组件、内存组...
The paper presents a cost-effective area-IO DRAM (aDRAM)/logic integration implemented with CLC (chip-laminate-chip)-based system-in-a-package (SiP) technology. By inserting 512 area-IOs into the aDRAM, the bandwidth of the area-IO DRAM can achieve 10 GB/s when working under 166 MHz....
In subject area: Engineering (System in package) [166] is a set of integrated circuits (combination of integrated circuits) assembled into a single package to form a system or a module. From: Computer Networks, 2018 About this pageAdd to MendeleySet alert ...
Our multi-chip LIN System-in-Package (SiP) is designed for your LIN-bus node applications, which demand high levels of integration with lower costs.
The SAMA5D2 and SAM9X60 SiPs simplify your designs by integrating SDRAM, DDR2 or LPDDR2 memory and, depending on the device, in a single package.
We have developed a new system-in-package (SiP) called a "System in Wafer-Level Package" (SiWLP). It is fabricated using "RDL-first" technology for fan-out wafer-level-packages (FO-WLPs) and provides high chip-I/O density, design flexibility, and package miniaturization. We developed thi...
To meet these trends, system-in-package (SiP) has been adapted as one of the core packaging technologies for many product applications. Among the various types of SiPs, SiP with embedded dies has become important due to the smaller size achieved through embedded dies and better electrical ...