On the morning of November 5, a vehicle loaded with semiconductor packaging equipment was warmly welcomed and driven slowly into JCET’s Chengdong factory. The production equipment of STATS ChipPAC Jiangyin Semiconductor Co., Ltd. (hereinafter referred to as JSCC) is moved in succession to the ne...
Semiconductor Packaging News - Exclusive: STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies
STATS ChipPAC receives top 20 semiconductor manufacturing patent ranking for fourth consecutive yearyole développement
STATS ChipPAC/PATENT LAW GROUP: Claims: What is claimed: 1.A method of making a semiconductor device, comprising:providing a semiconductor wafer having a plurality of conductive through silicon vias (TSV) formed through the semiconductor wafer;mounting the semiconductor wafer to a carrier;forming a...
A semiconductor wafer scale package system is provided including providing a semiconductor substrate having a through-hole via with a conductive coating, forming a filled via by fil
A semiconductor package system includes: providing a semiconductor die with bonding pad on the semiconductor die; attaching the semiconductor die to an intermediate layer; attaching one end of a bonding wire to the bonding pad; forming a bonding ball at the other end of the bonding wire, the ...
A semiconductor package system is provided including: a semiconductor chip; a substrate having a substrate opening and a vertical build-up wing, the substrate having the semiconduct
STATS ChipPAC/PATENT LAW GROUP: Claims: What is claimed: 1.A method of making a semiconductor device, comprising:providing a substrate;forming a first insulating layer over the substrate;forming a first conductive layer over the first insulating layer, a first resistive layer over the first conduc...
A method of manufacturing a semiconductor device includes providing a substrate with an insulation layer disposed on a top surface of the substrate, forming a passive device over th
A semiconductor device has integrated passive circuit elements. A first substrate is formed on a backside of the semiconductor device. The passive circuit element is formed over the