Recently, JCET, the global leading integrated circuit back-end manufacturing and technical service provider, announced its subsidiary STATS ChipPAC Korea Ltd. (hereinafter referred to as "SCK"), was presented the "Excellent Supplier Award" from Qualcomm’s RFFE Team. This award is in recognition of...
2015 JCET Acquired STATS ChipPAC 2020 JCET Management Co., Ltd. Established 2021 Automotive and IC Design Services BU Established 2021 New Logo and VI System Unveiled 2022 JCET Microelectronics Wafer-level Microsystems lntegration Project Commenced 2022 2021 197219892000200320032011201220152020202120212022Senio...
January 19th, 2022, Shanghai, China --- JCET, the global leading integrated circuit back-end manufacturing and technical service provider, announced its subsidiary STATS ChipPAC Korea Ltd. (hereinafter referred to as "SCK"), was awarded the "Supplier of The Year" by Montage Technology for its...
LTD. (JCAP) and STATS ChipPAC Korea Co., LTD ("SCK") each received the 2020 Supplier Excellence Award from Texas Instruments (TI) for their outstanding IC manufacturing and technical services. The Supplier Excellence Award is the highest recognition given by TI to its elit...
(2)ICET STATS CHIPPAC KOREA LIMITED(长申韩国) 长电韩国为长电科技全资子公司长电国际在韩国设立的全资子公司,主营高端封装测试产品主要进行高阶SiP产品封装测试。 2023年,总资产为98,201.39万美元,净资产为45,414.67万美元;营业收入173,187.39 万美元,比上年同期减少 6.33%;净利润 3,543.44万美元,比上年同期减...
Certification date: Expiry date: Certificate number: IATF Certificate number: 31 January 2021 30 January 2024 10338604 0383273 Certificate of Approval This is to certify that the Management System of: STATS ChipPAC Korea Ltd. (Plant 1) 191, Jayumuyeok-ro, Jung-gu, Incheon 22379, Republic of ...
Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Package by Nokibul Islam and Vinayak Pandey, STATS ChipPAC, Inc. Ming-Che Hsieh, STATS ChipPAC Pte. Ltd. Kang Keon Taek, STATS ChipPAC Korea Ltd. Originally published in the International Wafer Level Packaging Con...
Raj Pendse of STATS ChipPAC for their continued guidance in the study. The authors want to express gratitude to the individuals of STATS ChipPAC RnD team in Korea, our partner companies that helped design the advanced packages; including actual EM tests. 54 References [1] Nokibul Islam et al...
Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for Low Cost and High Performance Flip Chip Package by Nokibul Islam, Vinayak Pandey, *KyungOe Kim STATS ChipPAC Inc *STATS ChipPAC Korea Ltd. Originally published by IEEE 67th ...
重要内容提示: 交易简要内容:公司拟对子公司 STATS ChipPAC Pte. Ltd.(以下简称"星 科金朋")部分闲置的老旧固定资产进行处置. 本次资产处置不构成关联交易,不构成重大资产重组. 本次资产处置已经公司第七届董事会第七次临时会议审议通过,尚需提交 公司股东大会审议. 一,资产处置概述 为进一步优化公司...