After this step is done, you usually need to setup your favorite application to access the high level IrDA stack (via IrCOMM, IrLPT, IrNET, IrLAN or IrSOCK), which is documented elsewhere. This man page doesn't document the usage of the irport driver. The irport driver support the ...
Frederick C. Furtek. Asynchronous push-down stacks. Computation structures group memo 86, project mac, Massachussets Institute of Technologie, 1973. Google Scholar Concurrency and Nets Google Scholar 1982 Conference on Advanced Research in VLSI, M.I.T. Author information Authors and Affiliations Fraunho...
A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D ...
via a gate voltage sweep (−0.2 V to 4 V) where the leakage current is extracted at a 3 V gate voltage. For a benchmark of the different ferroelectric stacks, the accumulation capacitance was extracted at a gate voltage (−3 V) and plotted inFigure 6a for the HSO and HZO ...
In 2005 Symposium on VLSI Technology 226–227 (IEEE, 2005). Takahashi, M. et al. Gate-first processed FUSI/HfO2/HfSiOx/Si MOSFETs with EOT=0.5 nm: interfacial layer formation by cycle-by-cycle deposition and annealing. In 2007 IEEE International Electron Devices Meeting (IEDM) 523–526 (...
We read every piece of feedback, and take your input very seriously. Include my email address so I can be contacted Cancel Submit feedback Saved searches Use saved searches to filter your results more quickly Cancel Create saved search Sign in Sign up Reseting focus {...
have been stacked on top of each other in order to meet the demand for an increase in the capacity of semiconductor memories. With regards to this, in the case where signals are transmitted and received between chips via bonding wires, a problem arises such that the number of bonding wires...
Through-silicon via (TSV) based 3D chip stacks provide many resources for compact and fast inter chip communication within a chip stack. They allow the design of highly integrated, heterogeneous, and compact systems with reduced overall power consumption, but very limited heat dissipation capability....
Precise Taper-Angle-Control of Via Holes for Reliable Scaled-Down Low-k/Cu Interconnects A highly reliable Cu dual-damascene interconnect (DDI) was developed in a molecular-pore-stack (MPS) SiOCH film (k = 2.5) with precise taper angle control ... I Kume,N Inoue,Shinobu Salto,... - ...
An information-reading head having a structure comprising a floatable information-reading head, and a suspension comprising a load arm for supporting the information-reading head via a gimbal. The gimbal having a frame structure in a rev... Y Hatamura - US 被引量: 38发表: 1992年 Robust inf...