Amkor's Exposedpad TSSOP, MSOP, SOIC & SSOP are leadframe based packages suited for applications requiring optimal thermal performance.
迪米(思瑞浦)2017-9-23贴片运放TP1542A-双路(SOIC-8)-思瑞浦-RoHS 承认报告 第一次送样(黄灼)合格 广东华美骏达电器有限公司 材料样品报告 供 应 H M J D-Q R-02.33A/2
E CAT5115 PIN CONFIGURATION DIP Package (P, L) INC U/D RH GND 1 2 3 4 8 7 6 5 VCC CS RL RW PIN FUNCTIONS TSSOP Package (U, Y) CS VCC INC U/D 1 2 3 4 8 7 6 5 RL RW GND RH Pin Name INC U/D RH GND RW Function Increment Control Up/Down Control Potentiometer High ...
α 11 HI5960 Thin Shrink Small Outline Plastic Packages (TSSOP) N INDEX AREA E E1 -B1 2 3 L 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 GAUGE PLANE 0.25(0.010) M BM M28.173 28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 ...
R CAT5113 PIN CONFIGURATION DIP Package (P, L) INC U/D RH GND 1 2 3 4 8 7 6 5 VCC CS RL RW PIN FUNCTIONS TSSOP Package (U, Y) CS VCC INC U/D 1 2 3 4 8 7 6 5 RL RW GND RH Pin Name INC U/D RH GND Function Increment Control Up/Down Control Potentiometer High ...