SOIC-small-outline-integrated-circuit网络外形集成电路;小外形封装集成电路;小包装零件网络释义 1. 外形集成电路 ...大的封装移到一个较小和较便宜的封装 - 例如,从小外形集成电路(SOIC small outline integrated circuit)到小外形晶体管(SOT…www.2ic.cn|基于13个网页 2. 小外形封装集成电路 有关半导体材料及...
SOI(small out-line I-leaded package) I 形引脚小外型封装。表面贴装型封装之一。引脚从封装双侧引出向下呈I 字形,中心距1.27mm。贴装占有面积小于SOP。日立公司在模拟IC(电机驱动用IC)中采用了此封装。引脚数26。 SOIC(small out-line integrated circuit) SOP 的别称。国外有许多半导体厂家采用此名称。 SOJ(...
3.0, 10/2014 Small Outline Integrated Circuit (SOIC) Package 1 Introduction This application note provides guidelines for handling and assembly of Freescale Small Outline Integrated Circuit (SOIC) package during Printed Circuit Board (PCB) assembly. Guidelines for PCB design, rework, and package ...
The utility model provides a lead frame of a small outline integrated circuit package (SOIC) structure and a package device, and belongs to the technical field of chip package. The design of the lead frame considers the requirement of simultaneously packaging a crystal oscillator and a ...
Very is every day early very long time ago gets out of bed study English, in order to give oneself later enterprise.[translate] a16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow 16带领小概述集成电路(SOIC), JEDEC MS-012, 0.150狭窄[translate]...
Brand New Original TP8485E TP8485E-SR Transceiver 250kbps 8-Pin Integrated Circuit Small Outline IC T/R RS-485/RS-422 No reviews yet Shenzhen Grassroot Brothers Technology Co., Ltd.2 yrsCN Previous slideNext slide Previous slideNext slideKey attributes Other attributes Place of Origin ...
a订货代码:Order NumberMM74HC4538MMM74HC4538SJMM74HC4538NPackage NumberM16AM16DN16EPackage Description16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS...
a订货代码:Order NumberMM74HC4538MMM74HC4538SJMM74HC4538NPackage NumberM16AM16DN16EPackage Description16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS...
[4.81-5.00] NOTE 3 4 B ISO1044 SLLSFB0A – MARCH 2020 – REVISED JULY 2020 PACKAGE OUTLINE SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT .228-.244 TYP [5.80-6.19] PIN 1 ID AREA 6X .050 [1.27] 8 C SEATING PLANE .004 [0.1] C .150-.157 [3.81-3.98] ...
Thin Very Small-Outline Package (TVSOP) SCBA009E April 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant ...