The surface morphology of the composite coating is observed under a confocal microscope. Results show that uniform, dense, and smooth coatings with diamond and resin particles distributed homogeneously are obtained from the steel substrate. A large (桅150mm) polishing tool with a 20渭m-thick ...
Right now we are working on the next generation of 200 mm silicon carbide wafer which is going to come sooner or later”, says Bollina. Diamond suspensions from Pureon for excellent surface finishing Surface finishing is critical, since it is not possible to use any type of abrasive to get...
Wang, X.; Yuan, Z.; Zhuang, P.; Wu, T.; Feng, S. Study on Precision Dicing Process of SiC Wafer with Diamond Dicing Blades.Nanotechnol. Precis. Eng. 2021, 4(3), 033004. DOI: 10.1063/10.0005152. Google Scholar Chen, S. T.; Chiang, C. J.; Lin, P. A.; Huang, C. T. Eff...
12. A method of manufacturing a nanocrystalline P-channel diamond lattice field effect transistor, the method comprising: doping a nanocrystalline diamond region with boron to form the nanocrystalline P-channel diamond lattice region extending... Khan, Adam H - US 被引量: 608发表: 2008年 Semicondu...
By irradiating the Si-face, the substrates were processed with CMP for a short time using normal 1 wt% diamond+ 99 wt% deionized water eco-friendly slurry. The performance of nanosecond laser irradiation assisted chemical mechanical polishing (NLIA-CMP), including material removal rate (MRR) ...
关键词: UV LED composite electroplating copper-diamond sheet heat dissipation thermal resistance 会议名称: WIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 12 会议时间: 2011-04-25 被引量: 22 收藏 引用 批量引用 报错 分享 全部来源 免费下载 求助全文 IOP 掌桥科研 ResearchGate (全网免费下载) ...
An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades, a resin-bonded dicing blade and a metal-bonded dicing blade. The experimental research investigated the radial wear of the dicing blade, the maximum spindle current, the surface ...
silicon waferslurrydiamond wireThe present work compares the time-dependent evolution of the surface morphology during the horizontal acidic etching of diamond wire (DW) and SiC slurry (SP) sawn single-crystalline wafer by means of scanning electron microscopy (SEM), confocal microscopy, reflectivity ...
This new strategy of using the surface-ceramized intermetallic compound as a grinding wheel bonder provides significant implications for the development of high-performance SiC wafer thinning technology.doi:10.1016/j.diamond.2024.111874Shuai-peng Chen...
A comparative polishing experiment revealed that an ultra-smooth surface and a higher MRR were achieved when applying the ND/TiO2composite abrasives, superior to those of pristine diamond abrasives. This scenario is due to the SiC being oxidized by路OH and forming a relatively soft SiO2layer....