This paper examines the impact of VLSI technology on the evolution of computer architecture and projects the future of this evolution. We see that over the past 20 years, the increased density of VLSI chips was applied to close the gap between microprocessors and high-end CPUs. Today this gap...
The application of X-ray lithography could mainly provide advantages in the mass production of VLSI devices with constant design. The domain of e-beam writing, besides mask production, could be the production of circuits with frequent changes in design (e.g., in the phase of circuit ...
The VLSI technology more and more is obtaining the widespread application, therefore the VLSI technology is also facing even more user friendly, even more might carry out the aspect to develop, believes in the near future, the VLSI technology will be able% [translate] a你的邮件我已收到,由于...
In: Proceedings of VLSI Technology. Honolulu: IEEE. 2014 Google Scholar [61] Shulaker M M, Wu T F, Pal A, et al. Monolithic 3D integration of logic and memory: Carbon nanotube FETs, resistive RAM, and silicon FETs. In: Proceedings of Electron Devices Meeting. San Francisco: IEEE....
April 25, 2022 -- Menta will present its eFPGA soft IP for its first participation to ChipEx (May 10, 2022 in Tel Aviv), the major annual event of the Israeli semiconductor industry. Menta is the eFPGA provider that offers a revolutionary “soft IP” eFPGA technology. It can be ...
International Rectifier (NYSE:IRF) is a world leader in power management technology. IR's analog and mixed signal ICs, advanced circuit devices, integrated power systems and components enable high performance computing and reduce energy waste from motors, the world's single largest consumer of electr...
(C300 in 1988) and produced very advanced systems, but decided it couldn't compete alone in processor technology. After a brief joint development with Sun on the next generationSPARC, the company switched toIntel 80x86-based processors, and when a patent dispute between them erupted (Fairchild ...
Diamond-like carbon for use in VLSI and ULSI interconnect systems The present invention relates to semiconductor devices comprising as one of their structural components diamond-like carbon as an insulator for spacing apart one or more levels of a conductor on an integrated circuit chip. The ...
Throughout the decades of continuous advances in semiconductor technology, from the discrete devices of the late 1950s to today's billon-transistor system-... M Ramdani,E Sicard,A Boyer,... - 《IEEE Transactions on Electromagnetic Compatibility》 被引量: 412发表: 2009年 System on a chip: Ch...
At the moment when the VLSI technology is advanced to 0.5 m technology represented by 16 MDRAMs, electromigration by the highcurrent density of Al interconnections and the stress migration by the stress from the interlayer insulating films are important in reliability of Alinterconnections. Although ...