which enables ultra-thin die to be integrated in a more flexible and efficient manner through a revolutionary layer transfer process. Compared to traditional chip-to-wafer bonding technology, SLT not only significantly reduces chip size, but also...
The workshop during ESSDERC/ESSCIRC 2016 is organized by the NeuRAM3 project, which derives its name from “neural-computing architectures in advanced monolithic 3D VLSI technologies”. It will feature speakers from different EU and international programs and groups involved in development of neuromorphi...
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First electrical demonstration of integrated forksheet devices to extend nanosheets beyond 2 nm technology This week, at the 2021 Symposia on VLSI Technology and Circuits (VLSI 2021), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, demonstrated for the fi...
(HEP) applications, a test digital ASIC VLSI chip, called STRURED, has been designed and fabricated using a standard-cell library of commercial 130 nm CMOS technology by implementing three different radiation-tolerant architectures (Hamming, Triple Modular Redundancy and Triple Time Redundancy) in ...
A systematic review of the literature was performed using the databases: PubMed, Elsevier, and Google Scholar. The following keywords were used: “virtual reality”, “medicine”, “medical education”, “medical technology”, “virtual reality in medical training and education”, “virtual reality...
Brainware claims that more than $100 million have been invested in its core "neural network" classification and search technology, also called Brainware, which forms the basis for the company's two major product suites: IDC-Distiller, an automated data capture solution used for scanning tasks; ...
Chen I. C. et al.,“A Trench Isolation Study for Deep Submicron CMOS Technology” VLSI Technology, Systems, and Applications, 1993. Proceedings of Technical Papers. 1993 International Symposium on Taipei, Taiwan May 12-14, 1993, New York, NY, USA, IEEE, US, May 12, 1993, pp. 251-255...
Capabilities of the ARM720 core; Skepticism about the core; Performance of the ARM720 as compared to MIPs and Hitachi processors; Strategy of VLSI Technology's consumer digital entertainment in embedding support for ARM720.ClarkePeterElectronic Engineering Times (01921541)...
Camarota et al., “Applying a redundancy scheme to address post-assembly yield loss in 3D FPGAs”, 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers, pp. 1-2. Primary Examiner: SUN, MICHAEL Attorney, Agent or Firm: ...