Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to...
PC XT Preclean chamber for Endura II 设备详细信息 ID:9207042 晶圆大小:12" 12". 用過的 VARIOUS Lot of spare parts 产品 查看全部 VARIOUS Lot of spare parts 0 请求价格 VARIOUS Lot Lot of aluminum racks. 0 请求价格 VARIOUS Lot Lot of feeders: Qty \ Size: (82) 8-44 mm Vibratory ...
TFXH circular aspiration cleaning machine is a specialty equipment to separate impurities from the grain. It can be used solely or combined with other equipemnt. Advantages: twice closed circuit, circular aspiration, large subside chamber.Related Products...
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to...
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to...
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the ...
The RC values measured on a test vehicle with three-wire Kelvin test structures demonstrated a >60% lower RC and improved RC standard deviation. The new pre-clean chamber also enables higher throughput while maintaining a low wafer temperature for outgassing control.Kang Zhang...
Apparatus and methods use a unique process kit to protect a processing volume of a process chamber. The process kit includes a shield with a frame configured to be insertable into a shield and a foil liner composed of a metallic material that is attachable to the frame at specific points. ...
A method is also disclosed wherein an in-process integrated circuit wafer is first precleaned in the PVD deposition chamber by applying a negative voltage bias to the in-process integrated circuit wafer. A film of conducting material is then sputter deposited on the surface of the in- process...
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber, includes: a top plate having a central recess disposed in an upper surface thereof; a channel extending from an outer portion of the top plate to...