curve with your supply chain strategy: Reduced downtime: By identifying and fixing potential failures before they occur, you can reduce the amount of downtime your equipment experiences. This can save you money on repairs and lost production. Improved asset reliability: By optimizing your ...
Typical Electro-Optical Characteristics Curve E - I CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 2.5 2.0 1000 100 10 1.5 1.0 1.0 0.1 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 100 1000
Typical Electro-Optical Characteristics Curve VY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1000 3.0 2.5 2.0 100 10 1.5 1.0 1.0 0.1 0.5 0.0 1.0 1.5 2.0 2.5 3.0 1.0 10 100 1000 Forward Current(mA) Forwa...
cm S=0 +0.1/–0 mm S 3 元器件交易网www.cecb2b.com PF0341A Series Characteristics Curve Pout vs. Frequency (1) 10 PF0345A 8 Output Power Pout(1) (W) PF0340A 6 PF0340A PF0345A 4 512 MHz PF0341A PF0342A PF0343A PF0344A PF0341A PF0342A PF0343A PF0344A 2 Pin = 20 ...
flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is ...
cm S=0 +0.1/–0 mm S 3 元器件交易网www.cecb2b.com PF0311 Characteristics Curve VPC, ηT, VSWR (in) vs. Frequency 3 7 Pin = 20 mW VDD = 9.6 V Pout = 6.5 W 70 ηT 60 Efficiency ηT (%) Efficiency ηT (%) 6 2.5 PC Voltage VPC (V) V.S.W.R. (in) 5 50 2 4 ...
LE5330-PF Page 5/5 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: ...
The use of a standard algorithm and ECC curve ensures easy software integration. The originality check procedure in NFC devices does not require specific hardware. During production, each ICODE 3 UID is signed with an NXP private key. The resulting 32-byte signature is stored in the ...
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Max junction temperature: 125°C; power dissipation calculated at 25°C ambient temperature using JEDEC High K board Standard. Not to be used for steady state power dissipation in the breakdown ...
(mA) Forward Current Derating Curve Radiation Diagram Ta=25 o o o 50 0 0 1010 2020 o ) 30 A m ( 40 F I t n 40 e 30 r r u 25 1.0 o C d 20 50 r 0.9 a o w 60 r o 10 0.8 o F 70 o 80 0 o 0 20 40 60 80 100 0.7 90 Ambient Temperature Ta ( ) 0.5 0.3 0.10...