29、 金属芯印制板:metal core printed board 30、 金属基印制板:metal base printed board 31、 多重布线印制板:mulit-wiring printed board 32、 陶瓷印制板:ceramic substrate printed board 33、 导电胶印制板:electroconductive paste printed board 34、 模塑电路板:molded circuit board 35、 模压印制板...
Materials –Core substrates, prepreg, copper foils Imaging –Photoresists, direct laser/mechanical patterning Lamination –Stacking layers under heat and pressure Etching –Chemically etching away unwanted copper Drilling –Machines drilling holes for vias and mounting Plating –Electroplating copper over hole...
5.Lessens the Heat Transfer When it comes tothermal managementin HDI PCB, the heat transfer is lessened dramatically. It’s mainly because there is not much distance for the heat to travel right before it can easily escape the HDI PCB. Moreover, HDI PCBs also go through less stress because...
In contrast to the core, the prepreg effectively changes thickness while it gets pressed. As a result, the PCB manufacturer determines the thickness, organization of its processes, and amount of open space concerning copper-covered sections. PCB Internal Layer Thickness The stack-up customizes by...
Core Material 内层板材 , 核材 .Corner Crack 通孔断角 .Corner Mark 板角标记 .Counterboring 方型扩孔 . Countersinking 锥型扩孔 .Coupling Agent 偶合剂 .Coupon, Test Coupon 板边试样 . Coverlay/Covercoat 表护层 .Crack 裂痕 .Crazing 白斑 .Crease 皱折 .Creep 潜变 .Crossection Area 截面积 ....
Heat Distortion Point(Temp.) 熱變形點(溫度)—— 按 ASTM D468的標準試驗板,在固定外力之加壓(66或 264 PSI)與 逐漸升溫條件下,迫使該試驗板產生 10mil以上的彎曲變形量,該 項起碼溫度,謂之“熱變形點”。 Heat Transfer Paste 導熱膏,傳熱膏—— 指高溫安定性良好的矽樹脂 (Silicone) 油膏(Grease) 或...
4、L)覆铜箔层压板 Prepreg预浸材料 Bonding sheet/bonding layer粘结片 Epoxy glass substrate环氧玻璃基板 Copper-clad surface铜箔面 Foil removal surface去铜箔面 Length wise direction纵向 cross wise direction横向 Core material内层芯材 2.2 基材的材料 A-stage resinA 阶树脂 B-stage resinB 阶树脂 C -stag...
Thin Core——薄基材,多层板的内层是由薄基材制作. Twist——板翘,指板面从对角线两侧的角落发生变形翘起,称为板翘。其测量的方法是将板的三个叫落紧台面,再测量翘起的角的高度。 三、Level III Accelerate Aging——加速老化,使用人工的方法,加速正常的老化过程。 Annular Ring-—是指保围孔周围的导体部分 Ba...
Metal core PCBs are all boards which use a base metal material as the heat spreader portion of the circuit board. Learn More Layers: 1-10 Quantity: 1-1million pcs. Quality: Standard IPC2 Build time: 7 days-5 weeks Material: PI+FR4 ...
Thin Core薄基板. Thin Film Technology薄膜技术. Thin Small Outline Package(TSOP)薄小型绩体电路器. Thinner调薄剂. Thixotropy抗垂流性,摇变性. Three Point Bending三点压弯试验. Three-Layer Carrier三层式载体. Threshold Limit Value (TLV)极限值. Through Hole Mounting通孔插装. Through Put物流量,物料...