total LED application, be it the LED itself, the thermal interfaces, the heat sinks or the luminaire.First of all, the paper will discuss the reasons why thermal management is important, and then treat the basics of heat transfer: conduction, convection and the concept of thermal resistance. ...
Thermal vias in the PCB thermal pad are typically used to conduct the heat away from the device and to transfer effectively the heat from the top copper layer of the PCB to the inner or bottom copper layer or to the outside environment. This paper discusses our study on the impact of th...
Such a quick prediction capability of temperature rise of exposed pad packages for different PCB copper coverage areas can be a valuable tool for thermal design of PCB layout. 展开 关键词: thermal vias Exposed pad packages PCB thermal design heat transfer heat spreading copper planes thermal pad ...
Manufacturers assembling these devices to the PCB (printed circuit board) seek clear acceptance criteria for allowable solder voiding in the thermal pad of QFNs. When the design of PCBA (printed circuit board assembly), choice of assembly materials, and processes cannot preclude the formation of ...
In this paper, a thermal simulation model of the sealed vehicle controller has been setup. The temperature prediction validity of this model is verified by experiment measurement. Based on this model, multiple influencing factors on the maximum temperature of the print circuit board (PCB) are ...
In this paper, a silicon sub-mount based COB package was proposed which can rapidly transfer heat from the chip to a secondary cold-plate by removing the thermal resistance section of the metal PCB isolation layer and the thermal resistance section of the conventional PLCC package. This design ...
PCBthermal simulationthermal modeling.This paper initiates a measuring method to reduce the traditional threedimensional thermal circuit models into the twodimensional compact ones. The new thermal models are represented by the equivalent circuits which can be simulated in the SPICE. Furthermore, the ...
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Additionally, the effective use of thermal interface materials [18], such as Gallium with low thermal resistance, ensures efficient heat transfer between components and heat sinks. This paper focuses on enhancing the OBC front- end converter performance by incorporating wideband gap devices to reduce ...
The mechanism of the phonon heat transfer through the CNT-array-TIM was reviewed. The application performance of CNT-array-TIM in HB-LED packages was predicted by finite element analysis using ANSYS code. It was concluded that CNT arrays synthesized by the simple thermal CVD procedure is a ...