制造 4.1 通用术语 Subtractive process 减成法 Semi-additive process 半加成法 Build up process 积层法 Tenting 掩蔽法 Wet process 湿处理 Pattern plating process 图形电镀法 Reworking 返工 Panel 在制板,拼板 Prototype 试样板 Process flow 工艺流程 Lot size/ batch 批量 Additive process 加成法 Full-...
In the following section, we will look at the full automated assembly process for a double-sided mixed assembly board, meaning it has surface mount and through-hole components on both the top and bottom sides. To populate these boards, both surface mount and through-hole assembly lines are re...
The importance of these data lies in the ability of the full spectrometer system to record this wavelength accurately; this is because 280 nm falls outside of its working range of 350–880 nm and thus had little use when the device was sealed into its microfluidic form. Fig. 2: ...
and more. As ink formulations and printing processes continue advancing, ink-based circuit manufacturing empowers new design possibilities and applications. Understanding the composition, types, processes and properties of these conductive inks allows engineers to take full advantage of their capabilities an...
To take full advantage of this feature, the pad must be physically connected to the PCB substrate with solder. The published data for thermal performance, θJA, is based on a four-layer PCB incorporating vias that act as the thermal path to the layers, also known as a JEDEC High K ...
The presence of flux residues might also indicate that flux had not received full heat during wave soldering. The appearance of sulfur and barium ions in the IC test may indicate a decomposed solder mask. The benefit of the Ion Chromatography (IC) test is that it can identify and quantify ...
everything. In nutshell, basically the surface finishes are, usually the conventional surface finishes you see or have seen, are usually, their goal is to just protect copper by any means. And then it's the solder materials' responsibility to form a strong solder joints and realize the ...
When there is a need to build vias in two layers, one above the other as shown in Figure 4, and you don’t want to take the extra steps in plating the vias full of copper, there is an alternate approach. In this instance, you place the second via to the side of the first one ...
MECAFRANCE DN50 PN40 Full Bore, DN50-15 rexroth 821301500 rexroth 822121006 Lenord+Bauer GEL2443Y004 5V DC GEORGIN P96PXUTOS L:0.3MPA GEORGIN TM6GNX-CF-S6-008-AC-LE-DS-CB-00 5000NM3/H-8000NM3/H 0-10000NM3/H dunkermotoren Typ.GR63X25 SNR.88441 01905 + Typ.PLG52 SN.8885101760 hawe...
The compounds of interest include over 33 PCB congeners that have been equilibrated, in situ, for at least 10 years. Access through your organization Check access to the full text by signing in through your organization. Access through your organization ...