1、PCB英语词汇(一)1.综合词汇Prin ted circuit印制电路Pr in ted wir ing印制线路Prin ted circuit board印制电路板Pr in ted wir ing board印制线路板Prin ted comp onent印制元件Pr in ted con tact印制接点Sin gle-sided pri nted circuit board (SSB)单面印制电路板double-sided prin tedcircuit ...
Why Copper Pour is Used in PCBs NextPCB Special Offers and Discounts The Essential Guide to PCB Fiducial Marks: Enhancing Precision in PCB Assembly The Full Process of PCB "Gold Finger" from Design to Production PCB vs. PCBA: Understanding Key Differences and Manufacturing ProcessProducts...
Most objects placed in a PCB document will define copper areas or voids. This applies to both electrical objects, such as tracks and pads, and non-electrical objects, such as text and dimensioning. It is, therefore, important to keep in mind the width of the lines used to define each ...
The keyword entry InPolygon (or InPoly) should be included in the Full Query in this case, instead of IsPolygon (or IsPoly). The specific polygon clearance rule must also be given a higher priority than any general clearance rule, if it is to have any effect. During routing (and ...
Vias: Very small copper plated holes through the PCB that form an electrical bridge between the front and back sides. They are usually covered by the solder mask, but are lightly visible. Probably not very useful artistically, but you may need to add at least one to your board (see Step...
This step in the PCB manufacturing process marks the beginning of making the actual PCB. The process starts with the basic form of a PCB, which comprises a laminate board made from the substrate material. The substrate material usually is epoxy resin and glass fiber. ● The PCB design is pr...
Form:in Reel; Type:Pin Terminal; Material:Copper; Application:Conduct Electricity; L:30.2 Mm; Diameter:2.5 Mm; Finish:Tin Plated; Wire Size:0.2-0.4 Mm2; Form:in Reel; Type:Pin Terminal; Material:Copper; Application:Conduct Electricity; ...
in PCB Dictionary, BGA stands for Ball Grid Array. It is a Type of SMD Electronic Component no leads. This type of surface-mount packaging is used in Surface Mount Technology (SMT) and utilizes an array of metal spheres called solder balls for electrical interconnection. Solder balls are ...
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