该技术可从PCB供应商处获得,如德国Schweizer Electronic AG(称为p2Pack技术)或Advanced Semiconductor Engineering ASE Inc(称为嵌入式有源系统集成eASI(embedded active system integration)。图3(b)显示了用p2 Pack技术制造的嵌入式封装的横截面图。 双面微孔嵌入如图2(c)所示。在这里,芯片通过(非导电)粘合剂附着在...
Short circuit measurements and DESAT detection The designed measurement board is also used to test the short circuit behavior of the 1200 V CoolSiC Gen2p under very low-inductive and fast-switching applications. As the shunt resistor cannot withstand the high pulse energy in a short circuit event...
Packaging technology is a major challenge to tapping the performance potential of wide bandgap devices. This paper proposes a packaging design based on the printed circuit board embedded technology, chip-on-chip concept, and pressure-based contact. A silicon carbide DC-AC power module with 800V ...
1) Output current of PCB-embedded package was decreased under a certain gate-source voltage compared to SiC die; 2) Miller capacitance of SiC MOSFET was increased thanks to parasitic capacitance induced by package; and 3) compared with SiC die, nonflat miller plateau of the PCB-embedded packag...
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本文主要介绍PCB设计中的过孔。 过孔(via)是多层PCB的重要组成部分,一般多层PCB钻孔的费用通常占制板费用的30%到40%。PCB上的过孔从工艺制程上可以分为三类:盲孔(blind via)、埋孔(buried via)和通孔(through via)。盲孔位于印刷线路板的顶层和底层表面,具有一定深度,用于表层线路和下面的内层线路的连接。埋孔是...
据了解,该公司是我市首家落地投产的PCB电子电路企业,以购买标准厂房的方式投资建设PCB线路板生产项目。项目总投资1亿元,主要生产高密度电路板,月产通孔1万平方米,高密度互连板(HDI)1000平方米,多层板3000平方米。 贵港市万吉电子有限公司总经理 刘斌:目前公司致力于高密度电路板生产制造,产品广泛应用于通讯、家用电器...
L-com, an Infinite Electronics brand and a manufacturer of wired and wireless connectivity products, has released a series of embedded PCB antennas designed to integrate into self-contained wireless equipment developed by many OEMs and ODMs.
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DesignEmbedded Insights This is how an electronic system design platform works Renesas’ Altium acquisition bears fruit: A cloud platform that streamlines the design process from component selection to software development to OTAContinue Reading... ...