该工艺的后续步骤与Chip-on-Substrate工艺的步骤相同,需要真空层压、激光钻孔、镀铜和顶部轨迹的结构化。该技术可从PCB供应商处获得,如德国Schweizer Electronic AG(称为p2Pack技术)或Advanced Semiconductor Engineering ASE Inc(称为嵌入式有源系统集成eASI(embedded active system integration)。图3(b)显示了用p2 Pack...
schweizer.ag/fileadmin/user_upload/P2_Pack_Full_V3-720p.mp4 文章《Advancing Electric Vehicles with Innovative Chip Embedding and DriverTechnology》报道了测试性能。Infineon-Chip_Embedding_for_Silcon_Carbide-Article-v01_00-EN.pdf Double pulse measurements In figure 4 a recorded turn-off waveformcanbe...
Packaging technology is a major challenge to tapping the performance potential of wide bandgap devices. This paper proposes a packaging design based on the printed circuit board embedded technology, chip-on-chip concept, and pressure-based contact. A silicon carbide DC-AC power module with 800V ...
奥特斯PCB内埋芯片工艺介绍 AT_S_ECP_Overview
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奥特斯PCB内埋芯片工艺介绍-AT-S-ECP-Overview.pdf,ATS Advanced Packaging ECP® “The Leading Chip-Embedding Technology” Austria Technologie Systemtechnik Aktiengesellschaft | Fabriksgasse13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-mail info@ ATS – A
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半导体芯片和封装体的电学互联,通常有三种实现途径,引线键合(WB)、载带自动焊(TAB)和倒装焊(Flip Chip),一级封装的可以使用金属、陶瓷,塑料(聚合物)等包封材料。封装工艺设计需要考虑到单芯片或者多芯片之间的布线,与PCB节距的匹配,封装体的散热情况等。 二级封装 二级封装是印刷电路板的封装和装配,将一级封装...
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