专利名称:Memory module having on-package or on- module termination 发明人:Ryan M. Petersen,Franz Michael Schuette 申请号:US11162029 申请日:20050825 公开号:US07542305B2 公开日:20090602 专利内容由知识产权出版社提供 专利附图:摘要:A memory module adapted for installation in an open memory ...
A memory module adapted for installation in an open memory socket on a mainboard of a computer. The memory module includes a substrate with an edge connector comprising pins along an edge of the substrate, and at least one memory package mounted to the substrate and containing a memory die ...
POP assemblies today usually consist of just two packages, such as a memory device mounted on top of a logic device. Most companies that are developing POP assembly capabilities are leveraging well-established assembly processes and infrastructure (such as those used in CSP, BGA and flip-chips),...
In an embodiment, an electronic package comprises a package substrate with a first memory die stack on the package substrate, and a second memory die stack on the package substrate. In an embodiment, an electrically insulating layer is provided over the first memory die stack and the second ...
1.2.2 Simplification Categories The simplification items can be categorized based on their type of impact: Re-architecting for SAP HANA in-memory platform Used for functionality that is optimized to leverage the capabilities of the SAP HANA database, for example the new data model. ...
Developers can also benefit from the integrated DSP, MCU, radar hardware accelerator, and on-chip memory. The integration of the RF, digital, and antenna components on a single chip takes away a lot of design complexities and enables simpler and faster design. ...
Development of a novel stack package to fabricate high density memory modules for high-end application A new thinking has been spreading rapidly throughout the microelectronics community in the development and application of 3D stack package. Based on the co... C Kuo,JJ Chen - 《Microelectronics ...
For extremely high processor currents, VPD reduces PDN resistance by a further 10X over LPD by placing the current multiplier module directly underneath the processor. Delivering power vertically has the added advantage of opening up the topside PCB board area for high speed I/O and memory. VPD ...
A system-on-module (SoM) is a small PCB embedding the MPU, PMIC, DDR SDRAM, Flash memory and passive components. Optionally, the SoM can also add other functions including Wi-Fi or Bluetooth connectivity. The SoM can be directly soldered on the motherboard or plugged in via...
Fortunately, the use of PoP removes the cost, difficulty and challenge of routing high speed memory signals from under the applications processor to the memory. Instead, the memory sits on top of the processor and the connections are automatically made during PCB assembly. The remaining connections...