On-package decoupling optimization with package macromodels - Zheng, Krauter, et al. - 2003 () Citation Context ...), an equivalent series inductance (ESL), and an equivalent series resistance (ESR), with different effective ranges. Generally, for the same amount of ESC, a decap with a ...
This was usually also done for unreleased remote enabled function modules as the main use case for such function modules is an internal decoupling within one system. For interfaces that are usually called remotely, a different way has been chosen. For more information, see the specific chapter ...
Hello, I am looking for a model or file which has the value of on-die decoupling capacitors on power pins of the Cyclone V FPGA. I need this value of
It is well known that the addition of decoupling capacitors can significantly improve the electrical characteristics of the circuits on the chip and that the improvement is directly related to the length of the inductive path between the capacitors and the chip circuits. Because the addition of deco...
The decoupling techniques including the planes structure, surface-mounted technology decoupling capacitors, and embedded capacitors will be discussed. The isolation approach that keeps part of the PDN at high impedance is another way to reduce the PDN noise propagation. Besides the typical isolation ...
Simultaneous switching noise (SSN) and electromagnetic radiation were intensively examined experimentally by using different test LSIs and packages. Two types of test LSIs have been designed and fabricated in 0.25 um CMOS process. One was with on-chip decoupling capacitance (ODC), and the...
1. An integrated circuit (IC) package comprising: a substrate having a body and a base; a strain enhancing structure formed on the substrate, the strain enhancing structure mechanically isolating the base from the body and decoupling strain from the package; and one or more strain sensors dispos...
the low inductance using flip-chip attach technology may also contribute to higher emissivity, so tradeoffs must be analyzed. System and packaging costs can be decreased by proper design that allows removal of decoupling capacitors and lower overall inductance. This is especially important at higher ...
Review the applications processor datasheet for power assignments and recommended decoupling capacitor values. This paper will show the location of the decoupling capacitors for an example EVM module later. 12 Pad Type Before getting into the specific details, it is important to understand the pros,...
Figure 24. Close-Up of BeagleBoard Layer 6 - Bottom Side 20 OMAP35x Decoupling There are a lot of power pins on the OMAP35x. Decoupling capacitors are required and must be placed as close to the ball connection as possible. When selecting a power and ground, choose the ground closest ...