制程规模 本节从制程、规模以及尺寸等这几个物理尺度方面浅析Tesla旗舰芯片的演进,如图是各架构对应的芯片die。 NVDIA Tesla系列芯片得益于制程的尺寸不断缩小,在最新的GH100 Die Size仅相对GT200仅增大40%情况下,晶体管数目从GT200的1.4Billion提升到如今的GH100的80Billion,增大了56余倍,晶体管密度增大了40倍。(...
B200有两个Die,高速连接通道NV-HBI达到10TB/s。两个Die是一个统一的Cuda GPU。NV-HBI会占用一定的芯片面积。 内存: B200每个Die有4个24GB的HBM3e stack,合计一个Cuda GPU有192GB内存,内存带宽达8TB/s。相比H200时代六个内存控制器,可以减少内存接口的芯片面积,从而使得计算面积可以更大。 GB200: 有两个B200...
NV高带宽接口(Nvidia High Bandwidth Interface): B200有两个Die,高速连接通道NV-HBI达到10TB/s。两个Die是一个统一的Cuda GPU。NV-HBI会占用一定的芯片面积。 内存: B200每个Die有4个24GB的HBM3e stack,合计一个Cuda GPU有192GB内存,内存带宽达8TB/s。相比H200时代六个内存控制器,可以减少内存接口的芯片面积,...
虽然官网的资料显示192核心的Prodigy 2 是基于5nm工艺,但是今年6月的一篇新闻稿显示,Prodigy 2可能将会升级成3nm工艺。 以上的诸多提升,也使得Prodigy 2 处理器die size从 500mm²增加到 600mm²,增加了 20%。后续,Prodigy 处理器可能还会进一步增加内核数量,但芯片将会受到带宽限制。目前Prodigy 2 支持的是 16...
GPT-4 Profitability, Cost, Inference Simulator, Parallelism Explained, Performance TCO Modeling In Large & Small Model Inference and Training Nvidia’s announcement of the B100, B200, and GB200 has garnered more attention than even iPhone launches, at le
GPU Name GB100 Codename NV190 Architecture Blackwell Foundry TSMC Process Type 4NP FinFET Process Size 5 nm Transistors 104,000 million Die Size unknown Graphics Features DirectX N/A OpenGL N/A OpenCL 3.0 Vulkan N/A CUDA 10.0 Shader Model ...
Nvidia told at least one cloud provider that it might consider producing a version of the chip that only contains one Blackwell chip, in an effort to avoid the die issue and ship chips faster, according to someone who spoke with Nvidia about the delay. ...
The trend in GPU roadmaps is more silicon (for both logic and memory) in a bigger package and silicon-based interposers are hitting their limit in terms of size. The increased size makes silicon much harder to handle which kills yields. The B100 package is much larger, and as such it ...
很多人对这个剪刀差没有概念,我举一个具体的例子。Nvidia的B100 GPU芯片,其中GPU die的成本大概160美金,HBM颗粒大概1300美金,3D封装大概720美金,如果把NVLink的互联成本180美金也算进来, 你就会发现,大家念叨最多的GPU die反而是整个系统中最便宜的部件!
- b102: composed of one GPU die + 4 HBM3e; - b100: composed of two b102s; - GB200 motherboard: composed of two b100s + one Grace CPU; - Server: consisting of main boards and various system-level accessories (liquid cooling, copper cables, etc.). ...