Electronic packagingRiskResearchThe NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed ...
TheNASAElectronicPartsandPackaging(NEPP)Program:MemoryandAdvancedProcessorPlansKennethA.LaBelken.label@nasa.gov301-286-9936Co-Manager,NEPPProgra..
EOS Simulation and Failure Analysis of Metallurgically Bonded Silicon Diodes. Alexander Teverovsky, Ph.D. alexander.a.teverovsky.1@gsfc.nasa.gov QSS Group/Goddard operations, Greenbelt, Maryland Abstract Metallurgically bonded, glass-bodied DO-35 power rectifier diodes were electrically overstressed by ...
systems. In meeting this objective, the NEPP Program evaluates a wide variety of photonics components including optocouplers, LEDs, laser diodes, optical fibers, modulators, detectors, fiber optic links and accompanying conditioning and amplification electronics. These evaluations take into account those ...
The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assuranc...
NASA BGA Qualification IPC-9701
原文地址:http://nepp.nasa.gov/npsl/Wire/insulation_guide.htm Wire Insulation Selection Guidelines（NASA）电线绝缘材料选择指南（NASA）Insulation Types 绝缘类别Advantages 优点 Disadvantages 缺点 FEP and PTFE (Dupont TM Teflon)聚全氟乙丙烯和聚四氟乙烯 杜邦的特氟龙∙Excellent high temperature properties....
NASA Electronic Parts and Packaging (NEPP) Program - Innovative EEE Parts Resource for the FutureMichael J. CampolaAnnual Small Satellite Conference (SmallSat)
However, when you look behind the curtain, NEPP has been considering the risk trade space for small missions for over five years and has consistently provided resources that the small mission regime would find useful. In this paper, we provide a brief overview of these resources as well as ...
Miyahira, "Re- cent Photonics Activities Under the NASA Electronic Parts and Packaging (NEPP) Pro- gram", Proc. SPIE Photonics for Space Environments VIII, 4823, 189 (2002).Recent Photonics Activities Under the NASA Electronic Parts and Packaging (NEPP) Program, C. Barnes, M. Ott, A. ...