HAL lead free, HAL with lead, Hard gold plating, Immersion gold, OSP (ENTEK), Carbon printing and peelable mask. READ MORE + Materials FR4, and FR4 HIGH TG, CAF Resistant and Halogen Free, Rogers 3000/4000, Panasonic Material, Ventec, Isola, Shengyi, King Board. ...
Surface Finished HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold Materials FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm) Min PAD (inner layer) 5 mil(0.13mm) hole ring width Min th...
Surface finish/treatment HASL, lead free HASL ,Immersion Gold(ENIG),Immersion Tin ,Immersion Silver, OSP, Gold plating, Gold Finger, Carbon Ink, Peelable mask Copper foil thickness 18um-280um(0.5OZ-8OZ)(normally 1OZ) Solder mask color green/black/white/red/...
Was then subjected to electrolytic Cu plating step of forming a circuit pattern is printed again after the Cu plating the via hole is formed in the substrate; And repeated as necessary to form the insulating layer and a printed circuit pattern; In the production method of the multilayer printed...
A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of...
Therefore, when plating is performed at the through hole part of a laminated plate (f) and on the surface for forming a circuit, a reliable multilayered flexible rigid wiring board with improved drill-machining property can be manufactured.;COPYRIGHT: (C)1998,JPO...
This allows building the interconnect upside down on a temporary substrate using a continuous bottom level metallisation as an electrode for plating all level vias. This layer eventually becomes the upper conductor. After the processing is complete, the multilayer interconnect structure is either ...