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The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron accuracy.
The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron accuracy.
The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron accuracy.
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sig
MRSI-S-HVM submicron die bonder is the first fully automatic submicron die bonder with dual precision (0.5 μm and 1.5 μm) modes in the industry, with industry-leading high speed and high flexibility. The machine supports wafer level packaging, as well...