MIL-STD-883G temperature-cycling test 星级: 4 页 N–C–C–N–C–C 星级: 3 页 7 8c c = 9 = 5 c 5:7°c c = 9 = 5 c 5 星级: 10 页 E E C D D C C C D B B C B C C 第三志願 星级: 4 页 SD D Cl) -‘ C C-) 0 D C c) 星级: 32 页 c 入门 ...
内容提示: MIL-STD-883G METHOD 2011.7 22 March 1989 1 METHOD 2011.7 BOND STRENGTH (DESTRUCTIVE BOND PULL TEST) 1. PURPOSE. The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the ...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This...
MIL-STD-883G METHOD 1010.8 TEMPERATURE CYCLING 1. PURPOSE. This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes.1.1 Terms and definitions.1.1.1 Load. The specimens under ...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determinatio...
MIL-STD-883G METHOD 2015.13 18 December 2000 1 METHOD 2015.13 RESISTANCE TO SOLVENTS 1. PURPOSE. The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents. The solvents will not cause deleterious, mechanical or...
milstdgaoqsradiographicnonfilmfilm MIL-STD-883G METHOD2012.7 1June1993 1 METHOD2012.7 RADIOGRAPHY 1.Purpose.Thepurposeofthisexaminationistonondestructivelydetectdefectswithinthesealedcase,especially thoseresultingfromthesealingprocessandinternaldefectssuchasforeignobjects,improperinterconnectingwires, andvoidsinthedie...
静电放电发生器专门为IC、LED等半导体器件的抗静电测试而设计,仪器集成人体放电模式(HBM)和机械放电模式(MM)通过更换阻容模块来实现两种测试功能。 标准MIL-STD-883G、 METHOD 3015.7、EIAJED-4701ConditionA、EIAJED-4701ConditionB、GJB-548A-3015、SJ/T11394、SJ/T11399 优点 1.超大液晶显示,智能控制高压输出,...
对塑料电子封装结构内裂纹扩展规律进行理论评估,并利用加速寿命模型计算了热可靠性实验加速因子.最后根据MIL-STD-883G标准1010.8温度循环试验方法对塑料电子封装结构进行... 郭祥辉 - 《北京理工大学》 被引量: 3发表: 2015年 金锡薄膜回流时间研究 试验分析与讨论,优化AuSn焊料的设计及制备工艺,制作出在300℃焊接时...
美军标_芯片测试_MIL-STD-883H-1000.pdf,The documentation and process INCH - POUND conversion measures necessary to comply with this revision shall be MIL-STD-883H completed by 30 September 2010. 26 February 2010 SUPERSEDING MIL-STD-883G 28 February 2006 D