MIL-STD-883G_GAOQS 下载积分: 900 内容提示: MIL-STD-883G those resulting from the sealing process and internal defects such as foreign objects, improper interconnecting wires, and voids in the die attach material or in the glass when glass seals are used. It establishes methods, criteria, ...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This...
内容提示: MIL-STD-883G METHOD 1010.8 18 June 2004 1 METHOD 1010.8 TEMPERATURE CYCLING 1. PURPOSE. This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes. 1.1 Terms and definitions. ...
MIL-STD-883G METHOD 2011.7 22 March 1989 1 METHOD 2011.7 BOND STRENGTH (DESTRUCTIVE BOND PULL TEST) 1. PURPOSE. The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the applicable acquisitio...
CheckthesourcetoverifythatthisisthecurrentversionbeforeuseMIL-STD-883G FOREWORD 1ThisstandardisapprovedforusebyallDepartmentsandAgenciesoftheDepartmentofDefense 2Comment,suggestions,orquestionsonthisdocumentshouldbeaddressedto:Commander,DefenseSupplyCenterColumbusATTN:DSCC-VA,POBox3990,Columbus,OH43218-3990,orbye...
MIL-STD-883G METHOD 1010.8 TEMPERATURE CYCLING 1. PURPOSE. This test is conducted to determine the resistance of a part to extremes of high and low temperatures, and to the effect of alternate exposures to these extremes. 1.1 Terms and definitions. 1.1.1 Load. The specimens under test ...
MIL-STD-883G METHOD 2015.13 18 December 2000 1 METHOD 2015.13 RESISTANCE TO SOLVENTS 1. PURPOSE. The purpose of this test is to verify that the markings will not become illegible on the component parts when subjected to solvents. The solvents will not cause deleterious, mechanical or...
MIL-STD-883G METHOD 2019.7 07 March 2003 1 METHOD 2019.7 DIE SHEAR STRENGTH 1. PURPOSE. The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to package headers or other substrates. This determinatio...
中文标题(翻译):MIL-STD-883G方法1014.12密封,厂牌:Q-TECH,资料类型:其他,语言:英文资料,生成日期:28 February 2006,文档编码:METHOD 1014.12
对塑料电子封装结构内裂纹扩展规律进行理论评估,并利用加速寿命模型计算了热可靠性实验加速因子.最后根据MIL-STD-883G标准1010.8温度循环试验方法对塑料电子封装结构进行... 郭祥辉 - 《北京理工大学》 被引量: 3发表: 2015年 金锡薄膜回流时间研究 试验分析与讨论,优化AuSn焊料的设计及制备工艺,制作出在300℃焊接时...