日立化成新PCB基板材料赏析——环境友好型应用于高速/高频的MCL-HE-679G 环境友好覆铜板高速/高频高可靠性发展本文介绍了日立化成PCB用基板材料的发展路线,简介了高频的发展和要求,综述了MCL—HE-679G的性能特点。张家亮印制电路资讯
日立化成新PCB基板材料赏析——环境友好型应用于高速／高频的MCL-HE-679G
MCL-HE-679G Theta Circuit Materials Data Sheet
MCL-HE-679GLaminate,GHA-679GPrepreg AdvancedCircuitMaterialsDivision 100S.RooseveltAvenue,Chandler,AZ85226 Tel:480-961-1382Fax:480-961-4533.rogerscorp DataSheet 012345 ExposureTime(hrs.) D f DissipationFactorafterWaterAbsorption(1GHz) PCTCondition:121°C0.22MPS FR-4 ...
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由图8可见,MCL.LW.900G在不同温度 下,Dk&Df都很稳定。 5.3吸湿后对MCL—LW一900G的Dk&Df的 影响 表2MCL—LW一900G的一般性能 项目 条件 单位 MCL—LW一900G MCL—FX一2 HE-679G 玻璃布类型 E NE(低Dk玻璃布) E E 阻燃 无卤阻燃 无卤阻燃 ...
HeLa cells stably expressing a GAL4-luciferase reporter were seeded into 10 cm dishes at 5 × 105cells per plate. In all, 24 μg of a plasmid expressing both the ‘bait’ and ‘prey’ fusion proteins (GAL4DBD-BIM and VP16AD-BCL-2, GAL4DBD-BCL-XLand VP16AD- BCL-XS, or GAL...
MCL-LW-900G MCL-LW-910G MCL-HE-679G(S) 阻燃系统 - - 无卤素 玻璃布类型 - - 无碱玻璃 低介电玻璃 无碱玻璃 介电常数 10GHz* - 3.5-3.6 3.3-3.4 3.6-3.8 介电因数 10GHz* - 0.0040-0.0050 0.0025-0.0035 0.0070-0.0090 热膨胀系数
Showa Denko Materials開發的MCL-LW-900G/910G是一種無鹵印刷線路板材料,透過最佳化樹脂成分比例和使用低介電*2玻璃布來減少傳輸損耗和信號延遲。這種材料非常適合鑽孔,也適用於雷射鑽細孔。由於該材料可以與具有不同玻璃轉化溫度(Tg)的無鹵FR4(通用玻璃布基材)混合在一起進行層壓,因此也能有效降低高層數印刷線路板...
MCL-LW-900G/910G is a multilayer printed wiring board material with a low dielectric constant and excellent thermosetting properties using glass cloth as its base material. Features MCL-LW-910G achieved a dielectric constant of 3.3 and a dielectric loss tangent of 0.0028 (10 GHz) by combining...