In thi... CT Peng,CM Liu,JC Lin,... - 《IEEE Transactions on Components & Packaging Technologies A Publication of the IEEE Components Packaging & Manufacturing Technology Society》 被引量: 0发表: 2004年 Yield-enhanced routing for high-performance VLSI designs Koren, "Yield Enhanced Routing ...
With the recent advances of the VLSI technologies, stabilizing the physical behavior of VLSI chips is becoming a very complicated problem. Power grid optimization is required to minimize the risks of timing error by IR drop, defects by electro migration (EM), and manufacturing cost by the chip ...
Packages for integrated circuits come in a range of sizes. How much connectivity is needed will determine which package to choose. Many devices, such as basic logic chips, may only need 14 or 16 pins, but others, such as VLSI processors and accompanying circuits, may need 200 or more. Bec...
the corrosive structures preferably tantalsilizid / polysilicon - - (4, 3).the method is used for the manufacture of niederohmiger traces in vlsi circuits. 展开 收藏 引用 批量引用 报错 分享 文库来源 其他来源 求助全文 Process for manufacturing structures comprising me 优质文献 ...
VLSI Very Large Scale Integration Technology, Electronics, Computing CNC Computer Numerical Control Technology, Computing, Cnc Machine ShopsWhat's Next? Explore Further…Discover Manufacturing Abbreviations: Dive deeper into a comprehensive list of top-voted Manufacturing Acronyms and Abbreviations. Explore ...
Double Side Polishing for VLSI of Silicon Wafer This paper deals with double-sided polishing technology used in Si wafer production lines. The surface roughness and flatness of Si wafers, polished on a d... K Akamatsu,T Nakamura,M Masuda - 《Journal of the Japan Society for Precision Engineer...
Silicon VLSI Technology: Fundamentals, Practice and Modeling Prentice Hall (2000) Google Scholar [16] A. Baudrant, M. Sacilotti The LPCVD polysilicon phosphorus doped in situ as an industrial process J. Electrochem. Soc.: Solid-State Science and Technology, 129 (1992), pp. 1109-1116 Google ...
Lombardi, “Tile Based Design of a Serial Memory in QCA,” in Proceedings of the Great Lakes Symposium on VLSI, 2005, Chicago, IL, pp. 201–206. K.Walus, A.Vetteth, G.A.Jullien, and V.S.Dimitrov, “RAM Design Using Quantum-dot Cellular Automata,” in Proceedings of the IEEE ...
In recent years, semiconductor chips (hereinafter referred to as simply “chips”) having very large scale integrated circuit (VLSI) are frequently employed for forming critical portions in computers and communication equipments. The conformation of forming a stacked body of a plurality of chips is ...
EP 234896 discloses low dielectric constant material for use as a thick film in very large scale integrated (VLSI) devices. The material comprises a thick film insulation matrix, a thick film organic vehicle, and hollow silica glass microspheres for use in the formation of thick film circuits....