网络低介电常数材质;低介电常数介质;低介电常数绝缘材 网络释义
介电常数 介电常数在PCB行业中习惯叫Dk和Df,在英文中有一个单词(permittivity)和一个词组(dielectric constant )都表示介电常数,而“dielectric constant”直译过来就是“电介质常数”,由此可见,介电常数描述的是绝缘体在电场中的特性。 根据库伦定律,一个电荷,在真空中产生的电场强度为: 由于金属中有大量的自由电...
5) low-k dielectric 低k介质 1. The critical role of Cu/low-k dielectrics interconnections instead of conventional Al process played in the IC fabrication was demonstrated. 阐明了低k介质与铜互连集成工艺取代传统铝工艺在集成电路制造中所发挥的关键作用。 2. The chemical-mechanical global ...
The co-integration of low-K dielectric materials and Cu is still used today in the industry. Because of this architectural modification, the device manufacturers have been able to pursue Moore’s law in recent years [LE 13]. However, as characteristic dimensions are shrinking down to a few (...
随着铜互连以及low-k电介质在超大规模集成电路中地广泛使用,low-k电介质的机械完整性及其对互连可靠性变得更加重要。 Mechanical integrity of interlayer and intralayer dielectric films and its impact on int...
1、High-k与Low-k的分析 近十年来CPU业者每发表1款新主打CPU,就会顺带标榜该芯片所用的制程技术,最初只标榜尺寸缩密性制程,而近五年来更是强调各种新材质性制程,倘若不去了解新材质制程的意义,那么也将愈来愈不了解新CPU的价值意义过去IBM微电子发表Low k Dielectric(低介电质绝缘,或称:低介电常数绝缘)...
3) Low dielectric constant 低介电常数 1. Development of low dielectric constant polymer; 低介电常数聚合物研究进展 2. Recent research and development of low dielectric constant mate rials; 新型低介电常数材料研究进展 3. Nanoporous silica films have received significant attention in the ultra ...
Low-K dielectric material 优质文献 参考文献 引证文献Trench-gate semiconductor devices and their manufacture Trench-gate field-effect semiconductor devices, for example cellular power MOSFETs with compact geometries, comprise a semiconductor body () into which the trench-gate () extends from a surface-...
Dielectric constant k (also called relative permittivity ϵr) is the ratio of the permittivity of a substance to that of free space. A material containing polar components, which are represented as electric dipoles (e.g. polar chemical bonds), has an increased dielectric constant (Fig. 3)....
Method for forming backend interconnect with copper etching and ultra low-k dielectric materials A method for forming a metal interconnect structure provides a copper conductive layer which is etched to form conductive lines. A low k dielectric material is provided in the spaces formed between the ...