St, Flip Chip
网络无铅封装 网络释义 1. 无铅封装 l该制程有九层铜内部连接,并大量应用low-k夹层电介质(interlayer dielectric),再加上无铅封装(lead-free packaging)以改善耗 … www.showxiu.com|基于2个网页
IBM launches production of lead-free packaging technology. This article explains that IBM Corp. has begun production on its totally lead-free "controlled collapse chip connection new process" (C4NP) semiconductor packaging technology. The company claims that the technology now has a yield of 99.....
Lead-Free Electronics Packaging. Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder 来自 ResearchGate 喜欢 0 阅读量: 25 作者:H Shimokawa,T Soga,K Serizawa 摘要: This paper presents the mechanical properties and microstructure of Sn-Ag-Bi Pb-free solder. We evaluated ...
Gold nanoparticle inks were investigated as a potential candidate for lead-free packaging applications. Inks consisted of surfactant-passivated nanoparticles dissolved in a solvent. Optimized gold inks are able to sinter at temperatures as low as 120°C and achieve conductivities of up to 70% of ...
LEAD-FREE SOLDER AND PACKAGING METHOD USING THE SA 优质文献 相似文献Application of modified virtual crack closure method on delamination analysis in a plastic IC package during lead-free solder reflow are computed and studied using modified virtual crack closure method compared with the results using ...
专利名称：Packaging method using lead-free solder 发明人：Tetsuya Nakatsuka,Masahide Okamoto,Tomoyuki Ohmura 申请号：US10441662 申请日：20030519 公开号：US20030201310A1 公开日：20031030 专利内容由知识产权出版社提供 专利附图：摘要：This invention relates to a packaging method using lead-free solder,charac...
Packaging: About us: Jiangxi Longtai New Material Co., Ltd, founded in 2002, was successfully listed the New OTC Market in 2016, stock code: 836898. Longtai is specialized in the development and sales of all kinds of new materials, wire&cable materials and ariculture ...
Purpose – This paper seeks to review recent advances in wire bonding, flip chip and lead-free solder for advanced microelectronics packaging. Design/methodology/approach – Of the 91 journal papers, 59 were published in 2005-2007 and topics related to wire bonding, flip chip and lead-free sold...
SEMICONDUCTOR DEVICE PACKAGING HAVING PRE-ENCAPSULATION THROUGH VIA FORMATION USING DROP-IN SIGNAL CONDUITS A semiconductor device package having pre-formed and placed through vias and a process for making such a package is provided. One or more signal conduits are placed in a holder that is subsequ...