package n.[C] 1.包,包裹 2.【美】(包装食物用以出售的)盒,包 3.(出售或提供的相关东西或服务的)一套,一揽子 v.[T] 1.把……包成一包(扎成一捆) 2.将……包装(以备出售) gyro package 陀螺仪组 ready package 快装式 lead v.[T] 1.(走在前面)(给…)带路;(为…)开路;引导;带领 2...
package inductance 管壳电感 package lead 外壳引线 packaged chip 封装的集成电路 ... www.chuandong.com|基于18个网页 2. 组件引线 计算机通信工程翻译P-2... ... 程序包识别符 package identifier 组件引线 package lead 组件等级 package level ... www.scientrans.com|基于3个网页 3. 封装引线 机械......
package lead 英文package lead 中文【计】 外壳引线, 组装引线
2× aaa Z PIN 1 CORNER 4 E 12.85 5.50 REF 4.30 REF 7.40 ±0.10 1.30 REF 9.20 ±0.20 Y X 9.40 D PACKAGE TOP VIEW 4.30 REF 0.750 REF Ø 96x SUGGESTED PCB LAYOUT TOP VIEW BGA Package 96-Lead (16mm × 16mm × 11.27mm) (Reference LTC DWG # 05-08-7079 Rev Ø) ccc Z A1 b1...
HomeServicesPackage Lead Integrity Test Pin featuring components by QFP (Quad Flat Pack) often require rework and replacement with pins that are easy to get bent or broken. The lead integrity test is aimed at verifying a product’s resistance against external stress. ...
PAD "A1" CORNER 4 11.25 BSC PACKAGE TOP VIEW LGA Package 32-Lead (15mm × 11.25mm × 2.82mm) (Reference LTC DWG # 05-08-1773 Rev A) aaa Z 2.69 – 2.95 15.00 BSC 2.400 – 2.600 MOLD CAP DETAIL B SUBSTRATE 0.290 – 0.350 X Y DETAIL B 0.630 ±0.025 Ø 32x eee S X Y 0.630...
PACKAGE LEAD OF LIGHT TRANSMIT-RECEIVE MODULEPURPOSE: To reduce a wiring length by forming each of a plurality of package leads by adjusting any of a length from an edge face, an angle to an edge face and a height from a substrate.MORIYAMA YUTAKA...
网络引线封装 网络释义 1. 引线封装 引线封装(Lead Package)的标准部件 大多数具有Leadframe都是塑料芯片(PQFP, SOP, PLCC)部分为陶瓷芯片(CQFP) 通常由 … www.resheji.com|基于5个网页 例句 释义: 全部,引线封装
plastic-package-lead-frame网络塑料封装引线柜架网络释义 1. 塑料封装引线柜架 进出口货物名称中英对照... ... plastic overlay 塑料贴面 plastic package lead frame 塑料封装引线柜架 plastic paint 塑料漆 ... www.cuyoo.com|基于23个网页© 2024 Microsoft 隐私声明和 Cookie 法律声明 广告 帮助 反馈...
LEAD FRAME FOR SEMICONDUCTOR CONSTITUTION:After a lead frame 1, which is made of steel alloy material and formed into a predetermined pattern for a DIL (dual in line) package by photoetching or the like is subjected to a pretreatment of plating such as ... Y Osamu,Y Ryozo,N Sadao 被引...