类似零件编号 - JESD22-B106 制造商部件名数据表功能描述 Broadcom Corporation.JESD22-B106 147Kb/2P3mm Yellow GaAsP/GaP LED Lamps JESD22-B106 38Kb/1P17.3 mm (0.68 inch) General Purpose 5 x 7 Dot Matrix Alphanumeric Displays AVAGO TECHNOLOGIES LIMI...JESD22-B106 ...
JEDEC STANDARD Test Method B106C Resistance to Soldering Temperature for Through-Hole Mounted Devices JESD22-B106C (Revision of Test Method B106-B) FEBRUARY 2005 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
JEDEC STANDARD Resistance to Solder Shock for Through-Hole Mounted Devices JESD22-B106D (Revision of JESD22-B106C, February 2005) APRIL 2008 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
JESD22-B106 概述 3mm Yellow GaAsP/GaP LED Lamps JESD22-B106 数据手册 通过下载JESD22-B106数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。 PDF下载 HLMP-Y202-xxxxx 3mm Yellow GaAsP/GaP LED Lamps Reliability Datasheet Description The...
JESD22-B106D-2008 国外国际标准.pdf,JEDEC STANDARD Resistance to Solder Shock for Through-Hole Mounted Devices JESD22-B106D (Revision of JESD22-B106C, February 2005) APRIL 2008 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publicatio
内容提示: JEDEC STANDARD Resistance to Solder Shock for Through-Hole Mounted Devices JESD22-B106E (Revision of JESD22-B106D, April 2008) NOVEMBER 2016 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION Solid State Technology AssociationProvided by IHS under license with JEDEC Licensee=SHENZHEN ACADEMY OF ...
JESD22-B106E Resistance to Solder Shock for Through-Hole Mounted Devices 通孔安装期间的耐焊接冲击 热度: Rapid heat treatment to improve the thermal shock resistance of ZrO2 coating for SiC coated carboncarbon composites 热度: BS英国建筑规范Document C - Site Preparation And Resistance To Moisture ...
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capacitors for use in electronic equipmment http://hi.baidu.com/sadsadasddsa/blog/item/d4d2fd31c6d6fd4fad4b5fa2.html JIS C 5101-2-1 2009 Fixed capacitors for use in electronic equipment Part 2 http://hi.baidu.com/sadsadasddsa/blog/item/d563492012090ca84623e8a3.html ...
JEDEC JESD22-B106C-2005 适用范围 该测试方法用于确定固态器件是否能够承受在波峰焊工艺和/或焊料喷泉(返工/更换)工艺中焊接其引线期间所遭受的温度冲击的影响。热量通过电路板背面的焊料热量通过引线传导到器件封装中。该测试方法不得用于模拟表面贴装器件封装的波峰焊接,这些器件封装与波峰焊粘在电路板的同一侧,并...