EFFICIENT INTER-CHIP INTERCONNECT TOPOLOGY FOR DISTRIBUTED PARALLEL DEEP LEARNINGThe present disclosure provides a system comprising: a first group of computing nodes and a second group of computing nodes, wherein the first and second groups are neighboring devices and each of the first and second ...
ABMH Rashid,S Watanabe,T Kikkawa - IEEE International Interconnect Technology Conference 被引量: 0发表: 2003年 ULSI Wireless Interconnection Using Integrated Antennas for Ultra-Wide-Band Signal Transmission Inter/intra-chip wireless interconnection technology using fractal antennas for ultra-wide-band (UWB...
Networks-on-chip in emerging interconnect paradigms: Advantages and challenges Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a prom...
HSIC Device Using Synopsys USB 2.0 Device Controller and HSIC PHY USB chip-to-chip interconnect can be achieved with the use of both Synopsys device controller and HSIC PHY. It eliminates USB cables and connector connection down to two wires for high speed chip-to-chip communication. It also ...
Inter-chip wireless interconnect technologies such as inductive coupling and electromagnetic wave propagation have been developed for future high performan... Takamaro,Kikkawa - 《Microelectronic Engineering》 被引量: 9发表: 2011年 Design and Performance Evaluation of a 10GHz 32nm-CNTFET IR-UWB Transmit...
USB High Speed Inter-Chip (HSIC) IP: What is it? And why should I use it? What is HSIC? HSIC (High-Speed Inter-Chip) is an industry standard for USB chip-to-chip interconnect with a 2-signal (strobe, data) source synchronous serial interface using 240 MHz DDR signaling to provide ...
摘要: substrate. Figure 2.4 Antenna Layout To compare the antenna performance, antenna transmissiongain (TG) is derived using Friis transmission formula ( )( )2 Further, the power dissipated by RFinterconnect support circuit is much larger than that of a global wire. Thirdly, the 年份: 2003 收...
It is becoming increasingly attractive to use USB as a chip-to-chip interconnect within a product (without the use of external cables and connectors). However, because USB was designed to enable hot-plugging of peripherals over cables up to 5 meters in length, there are certain power and imp...
within a product (without use of external cables and connectors). However, because USB was designed to enable hot-plugging of peripherals over cables up to 5 meters in length, there are certain power and implementation issues that are not attractive for many chip-to-chip interconnect solutions....
机译:对于寻求高性能和高能效的应用,Manycore处理器系统正成为有吸引力的平台。然而,内核之间巨大的通信需求和高功率密度是单处理器芯片可扩展性的两个重要限制。同时,有限的片外带宽也严重限制了互连多个芯片以形成大型多核处理器系统的潜力。在本文中,我提出了基于新兴的硅光子技术的光网络,以有效解决芯片内和芯片...