EFFICIENT INTER-CHIP INTERCONNECT TOPOLOGY FOR DISTRIBUTED PARALLEL DEEP LEARNINGThe present disclosure provides a system comprising: a first group of computing nodes and a second group of computing nodes, wherein the first and second groups are neighboring devices and each of the first and second ...
HSIC (High-Speed Inter-Chip) is an industry standard for USB chip-to-chip interconnect with a 2-signal (strobe, data) source synchronous serial interface using 240 MHz DDR signaling to provide only high-speed (480 Mbps data rate). No external cables or connectors and hot plug-n-play are ...
To better meet the needs of a USB chip-to-chip interconnect, HSIC removes the analog transceivers, thus reducing complexity, cost and manufacturing risk. USB 2.0 HSIC PHY is a 2-signal (strobe, data) source-synchronous serial interface which uses 240Mhz DDR signaling to provide High-Speed 480...
because USB was designed to enable hot-plugging of peripherals over cables up to 5 meters in length, there are certain power and implementation issues that are not attractive for many chip-to-chip interconnect solutions.
HSIC Device Using Synopsys USB 2.0 Device Controller and HSIC PHY USB chip-to-chip interconnect can be achieved with the use of both Synopsys device controller and HSIC PHY. It eliminates USB cables and connector connection down to two wires for high speed chip-to-chip communication. It also ...
High Speed Inter-Chip_1_0 final High-Speed Inter-Chip USB vsn 1.0 September 23, 2007 High-Speed Inter-Chip USB Electrical Specification Version 1.0 Page 1 of 16
type antenna diversity system in an asynchronous manner, and may be employed to achieve simultaneous antenna diversity for multiple RF signal types using a scalable IC communication link architecture that includes multiple IC communication links to interconnect a varying number of RF tuner circuit chips...
近日,Chiplet互联协议标准《芯粒间互联通信协议》(Chiplets Interconnect Protocol,CIP)获批成为中国电子学会团体标准,标准号为T/CIE 192-2023,将于2024年1月1日开始实施。 该标准由中国电子科技集团公司第五十八研究所牵头,联合电子科技大学、中国电子科技集团公司...
To address the issues, the RF/wireless interconnect con- cept has been introduced [6], [7]. The RF/wireless data link im- proves system reliability and flexibility since the signal atten- uation in the air is comparable with that of Cu channel in high data rate for relatively short ...
Because current loops always seek the path of least impedance, this sparsity makes the loops formed by interconnect currents and their equal and opposite ground return currents wide at low frequencies (when R >> jωL) and narrow at high frequencies (when R ≈ jωL). This variation in ...