However, individual ESCs do have some drawbacks, such as requiring more soldering and wiring, which can result in a slightly heavier drone due to the added weight of wires and the power distribution board. Additionally, the mass of the ESCs is further away from the center of the drone, whic...
267 ns . 400 ns This time is used to filter the spike on the PFC_CS pin at the PFC MOSFET turn-on. During this time the PFC_CS comparator output (THD improver) is ignored. Use Adjust the blanking time according to design requirements. The middle value 267 ns can be ...
And all of this adds a layer of complexity. “Designers haven’t done real thermal analysis with meshing and everything,” says Ansys’ Swinnen. “They’ve used power density as a proxy for thermal. The traditional chip tools can calculate power density, meaning how much power is being use...
Transistors are normally recognized by their external package in which the particular device may be embedded. The most common types of package in which these useful devices are enclosed, are the T0-92, TO-126, TO-220 and TO-3. We will try to understand all these specifications of transistors...
Due to component tolerances and power loss of the regulator, the peak current limit should be set some margin above the calculate peak inductor current. A margin of 20% to 40% (MI_LIMIT = 0.2) is a good starting point. Equation 5 is used to calculate the desired peak inductor current ...
Two (B) capacitors were selected for a total effective capacitance of 6 µF, and an allowable ripple current of 5.2 ARMS with a 10°C temperature rise. 2. Add small ceramic capacitor(s) with low ESL to alleviate input spikes and phase-node ringing With MOSFET technology advancement, ...
more and moreelectronic companies in the worldare shifting to RoHS. This has given rise to another form of solder called lead-free solder. This solder is called lead-free because there is no lead in it. Lead-free solder alloys melt around 250°C (482°F), depending on their composition....
One of my pet peeves is when my fellow engineers misinterpret component datasheets. This happened a few times recently in separate instances, all involving power MOSFETs. So it’s time for me to get on my soapbox. Listen up! I was going to post...
This led to underestimated costs and emissions for IGBT and Si-MOSFET variants, since the lower switching frequency would require larger components than the SiC design. To first calculate manufacturing life-cycle costs, we created a bill of materials...
The most common time frame is a few days before the mass production deadline. There has not been a single documented case of a design engineer having discovered the problem during simulation. The question of how to turn on a MOSFET, or at a more basic level, the minimum voltage that ...