The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K.doi:US20090004317 A1Xuejiao HuLeonel R. AranaRobert M. NickersonRahul N. Manepalli...
The epoxy molding compound (EMC) with thermal conductive pathways was developed by structure designing. Three kinds of EMCs with different thermal conductivities were used in this investigation, specifically epoxy filled with Si3N4, filled with hybrid Si3N4/SiO2, and filled with SiO2. Improved therm...
High-temperature purging products support maintenance practices with numerous benefits such as thermal stability, mechanical strength, chemical resistance and durability. Yet, not all purging compounds are created equal. According to Slide Products, unlike most abrasive purging agents, Hi-Temp Purge has ...
The role of underfill and molding compound (MC) on temperature management, migration phenomena and stress reduction in a ball grid array (BGA) was investigated. Therefore, thermal-electrical-mechanical finite element simulations were conducted using ANSYSand a model of a bump chain being common for...
Phenolic Resin For Molding Compound Acetylene Tackifying Resin Phenolic Resin For Heat Preservation Material Phenolic Resin For Mine Filling Phenolic Resin For Filter Paper Other Productions: BPF Product Description The products have many advantages such as high thermal...
专利名称:High thermal conductivity/low alpha emission molding compound containing high purity semiconductor filler and integrated circuit package 发明人:Candice H. Brown,Homi Fatemi 申请号:US07/180421 申请日:19880412 公开号:US04931852A 公开日:19900605 专利内容由知识产权出版社提供 摘要:The invention...
High Performance Molding FCBGA Packaging Development In addition, mold compound properties have high potential to meet Pb-free solder bump and low-K requirements. A high reliability, high thermal performance... HY Tsai,J Huang,S Chiu,... - International Conference on Electronic Packaging Technology...
Degradation of an aromatic and a straight-chain polymer due to thermal aging Hence mechanical properties, high-temperature capability, and chemical resistance improve. These properties can be often equal to or even better thancrosslinked thermosetting polymers. ...
6E.R Hnatek, “Section 5: Thermal Management,” Practical Reliability of Electronic Equipment and Products, New York, NY: CRC Press, 2002.7National Research Council, “Appendix A: Silicon as a High-Temperature Material,” Materials for High-Temperature Semiconductor Devices, Washington, DC: The ...
High technology SMC Sheet Molding Compound SMC making Machine Line, FRP Machine for boats yachtsApplication: SMC Prepreg production line(smc machine) is used to produce SMC FRP Prepreg ( thermolding plastics).It produces smc sheet by forming sand...