Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the ...
A heat-dissipating unit is provided. The heat-dissipating unit includes a board. The board is thermally conductive and includes a contact portion planar in shape. The contact portion is in immediate contact with a heat-generating source for the sake of heat transfer. An integrally formed branch...
In a heat-dissipating module for an electronic device, a heat-conducting unit is adapted to be disposed in close contact with a heat-generating component, and includes inner and outer tubes that cooperatively confine an enclosed chamber filled with a thermal superconductor material. A fan unit is...
A heat-dissipating fan with a plurality of upward rotor blades is provided. The heat-dissipating fan includes a housing, an impeller having a hub and a plurality of rotor blades disposed around the hub, and a base disposed inside the housing for supporting the impeller thereon. The rotor ...
The way heat is dissipated in boron arsenide and other crystals is linked to the vibrations of the material. As the crystal vibrates, the motion creates packets of energy called phonons, which can be thought of as quasiparticles carrying heat. ...
1. A heat-dissipating module comprising: a heat-conducting unit adapted to be disposed on a heat-generating component of an electronic device, said heat-conducting unit including a hollow inner tube that is made of a heat-conducting material and that confines a first chamber, and a hollow out...
A heat-dissipating assembly includes a plurality of heat-dissipating devices, each of which includes a frame having at least one locating window for allowing the heat-dissipating device to inhale air and discharge airflow, and a stream-guiding wall formed beside the locating window; and at least...
A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel betwee...
HEAT-DISSIPATING DEVICE 专利名称：HEAT-DISSIPATING DEVICE 发明人：Chun-Ming Wu 申请号：US13409110 申请日：20120301 公开号：US20130168056A1 公开日：20130704 专利内容由知识产权出版社提供 专利附图：摘要：A heat-dissipating device includes a base and a heat pipe. One side of the base is provided ...
A method of heat dissipating for plug-in boxes (4, 5, 6) in a cabinet (3), an air-guiding apparatus and communication equipment. The pluralities of plug-in boxes (4, 5, 6) are mounted in the cabinet (3) from top to bottom. At least two branches of airflow for heat dissipating...