The heat dissipating sheet includes a metal layer having a first surface and a second surface, at least one graphene layer having a first surface and a second surface, wherein the second surface of the graphene layer comes in contact with the first surface of the metal layer, a protective ...
The heat dissipating sheet includes a metal layer having a first surface and a second surface, at least one graphene layer having a first surface and a second surface, wherein the second surface of the graphene layer comes in contact with the first surface of the metal layer, a protective ...
A heat dissipating sheet excelling in heat dissipating characteristic (thermal conductivity) in the thickness direction, adhesion to the part to be cooled, and electrical insulating quality. In a heat dissipating sheet (1) wherein a plurality of insulators (3) having high thermal conductivities are...
Fig. 3: Device performance of the stretchable and heat-dissipating devices based on MoO3/Au/MoO3 (MAM) with and without SiO2 NPs. a, d The schematic illustration of GSOLEDs and ‘Stretchable & Non-Heat dissipating devices’ with the 3 M elastomer, and ‘Stretchable & Heat dissipating ...
COMPOSITION, AND HEAT-DISSIPATING ADHESIVE SHEET OBTAINED BY MOLDING THE SAME 发明人：TANAKA KAZUYA,田中 一也 申请号：JP2014098276 申请日：20140512 公开号：JP2015214648A 公开日：20151203 专利内容由知识产权出版社提供 摘要：Array 申请人：MITSUBISHI PLASTICS INC,三菱樹脂株式会社 地址：東京都千代田区丸の...
The problem of dissipating heat is an important issue in many electrical and electronic applications, such as in electrical wires and cables. Increased heat dissipation can be obtained with finned surfaces, which are of great importance in many energy systems, such as economizers in steam power pl...
PROBLEM TO BE SOLVED: To provide a heat-dissipating sheet in which handling properties are improved with a high flexibility and a high thermal conductivity regarding the heat-dissipating sheet disposed to an electronic part such as an integrated circuit and efficiently dissipating a heat generation fr...
PROBLEM TO BE SOLVED: To provide a heat dissipating sheet which intervenes between a heating structure and a radiator, for effectively conducting heat released from the exothermic body to the radiator to suppress an increase in temperature of the exothermic body, thereby enhancing its resilient chara...
The present invention generally relates to radiation emitter assemblies such as, for example, light emitting diode (LED) packages and to heat dissipating packages for electronic components. Radiation emitters, particularly optical radiation emitters, are used in a wide variety of commercial and industrial...
metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat ...