FC-LGA 英文全称Flip-Chip Land Grid Array 中文解释反转接点栅格阵列 缩写分类电子电工, IR红外线 IrDA红外线通信接口 K8HTBK8闪电传输桥 LSI大规模集成电路 LPC少针脚型接口 MBA管理启动代理 MC内存控制器 MCA微通道架构 MCH内存控制中心 MDC移动式子卡
FC-LGA 英文缩写FC-LGA 英文全称Flip-Chip Land Grid Array 中文解释反转接点栅格阵列 FC-LGA意思,FC-LGA的意思,FC-LGA是什么意思?爱站小工具网缩写频道为您提供有关于FC-LGA的解释和缩写,反转接点栅格阵列的英文缩写是什么
ASAT Holdings Limited (NASDAQ:ASTT) and ASAT Inc., global providers of semiconductor package design, assembly and test, has begun providingflip chip land grid array(LGA) technology to Shanghai Fudan Microelectronics Company Limited for multimedia applications. ...
A apparatus and method for providing a radio frequency ( RF ) input/output ( I/O ) land grid array ( LGA ) package (301) structure is described. The package structure comprises grounded shield rings (307) surrounding free-standing RF I/O interconnects (305). The free-standing RF I/O ...
Medical Encyclopedia aero- (word root) air, gas Examples of words with the root aero-:aerobatics,aerosol Abused, Confused, & Misused Words by Mary Embree Copyright © 2007, 2013 by Mary Embree aer·o (âr′ō) adj. Aerodynamic in styling. Used especially of automotive vehicles. ...
A novel apparatus and method for providing a radio frequency ("RF") input/output ("I/O") land grid array ("LGA") package structure. The package structure comprises grounded shield rings surrounding free-standing RF I/O interconnects. The free-standing RF I/O interconnects eliminate long leads...
Flip-chip Flip-Chip Ball Grid Array Flip-Chip Chip Scale Package Flip-Chip Land Grid Array flip-flap flip-flop Flip-flop (electronics) Flip-flop (footwear) Flip-flop (footwear) Flip-flop (politics) flip-flop amplifier flip-flop circuit flip-flop flap flip-flop flap flip-flop flap Flip-Flo...
专利名称：Composite lid for land grid array (LGA) flip- chip package assembly 发明人：Tz-Cheng Chiu 申请号：US10631130 申请日：20030731 公开号：US06784535B1 公开日：20040831 专利内容由知识产权出版社提供 专利附图：摘要：A composite lid for a semiconductor package, in which the lid includes at ...
The package chosen for this processor is a molded plastic land grid array (PLGA) because the final mounted height is kept to a minimum while maintaining robustness and reliability requirements. The package itself is only 9.6 mm x 9.6 mm x 0.805 mm. This paper explores the packaging design, ...
6191477Leadless chip carrier design and structure2001-02-20Hashemi 6097089Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package2000-08-01Gaku et al. 6075710Low-cost surface-mount compatible land-grid array (LGA) chip scale package (...