ACCµRA™Plus: Production Flip Chip / Die Bonder for Optoelectronic and Silicon photonics applications The SET ACCµRA™Plusis aflip-chip / Die bonderdesigned for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCµRA™Pluscombine...
主要零件的本土化和新技术不断开发使得SEC具备了和世界大企业相抗衡的竞争力。 了解更多 产品中心 产品中心 —— Flip Chip Bonder Ion Sputter Coater X-eye 6000 POP X-eye NF120 X-eye 6300 X-eye 6200 X-eye 6100 X-eye 5100 Series X-eye SF160 Series ...
Flip Chip Bonder 半导体封装设备 Flip Chip Bonder 韩国赛可检测设备有限公司 仪器种类:型号:Flip Chip Bonder 详细参数和报价申请演示询 价 产品简介
晶元级封装设备fli..半导体高阶封装倒装 flip chip .在wafer die pad上植金球,钝化 倒装芯片,适用高阶封装,美国KNS AT Premier 晶元植球机器,
Find out all of the information about the TDK Electronics Europe product: flip-chip die bonder AFM Series. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
随着集成电路封装密度提高,芯片上的引脚由四周分布变为全芯片表面分布,而对应基板上的引脚也由四周分布变为全基板分布。传统的Die bonder和Wire Bonder设备已经无法满足这种新型引脚分布的封装要求,因此倒装焊…
Flip Chip Bonder Lineup Compatible with Various Bonding Methods Outline Compatible with various processes, including CoW, CoC, and CoS. Customization is possible according to the requirements. Applications HPC, PLP, Server CPU, Application Processor, etc. ...
Find out all of the information about the HANWHA product: flip-chip die bonder SFM5. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.
倒装贴片机 FC520(Flip Chip FC520) 全自动智能共晶贴片机 EP2000(Fully Automatic Intelligent Eutectic Bonder) 晶圆智能自动检测机 AOI-W500 AOI-W500 全自动共晶贴片机 EP2000 全自动智能共晶贴片机 AOI-TP300 晶圆表面缺陷检测设备 AOI-W500 Flip Chip倒装贴片机 FC520 全自动FAC/SAC检测机 AOI-NM1000(Fully...
FlipChipBonder特点:Chip-to-WaferFlipchipbonderforNCF-TCBprocessCapableofhigh-speed详细介绍 Flip Chip Bonder特点: Chip-to-Wafer Flip chip bonder for NCF-TCB process Capable of high-speed, high-precision flip chip bonding by adopting probe camera technology and linear motor High precision control ...