An epoxy molding compound is provided, the compound comprises (a) 2 to 15wt.%of an epoxy resin; (b) 2 to 15wt.%of a phenolic resin; (c) 60 to 90 wt.% of a filler; (d) 0.1 to 0.6wt.%of a catalyst; (e) 0.1 to 3 wt.% of a releasing agent; (f) 0.1 to 1 wt.% of...
SJ Cho,KW Paik,YG Kim - 《IEEE Transactions on Components Packaging & Manufacturing Technology Part B》 被引量: 86发表: 2002年 High thermal conductive epoxy molding compound with thermal conductive pathway The epoxy molding compound (EMC) with thermal conductive pathways was developed by structure ...
A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a halogen (which can be part of the res...
This post will focus on the epoxy molding process using liquid and solid EMC for FOWLP. In the image on the left, a liquid EMC is shown on the surface of the partially reconstituted wafer prior to compression molding (source: Nanium). For FOWLP, the compression m...
When using prepreg materials in the manufacturing process, up to 10% of the prepreg turns into waste due to off-cutting. For a 5.4 tonne blade, this means that nearly 6 tonnes of material is needed. This post-industrial waste material also needs to be dealt with. Recently, filament winding...
Epoxy resin casting molding process and mold design is a comprehensive technology which the casting process method, mold design and manufacturing technolog... XM Wang,XY Cheng,BH Fan - 《Shanghai Plastics》 被引量: 0发表: 2012年 THERMOFUSION EPOXY FILM HAVING RAPID CURABILITY AND EXCELLENT STORA...
摘要: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package, by utilizing a semiconductor package structure capable of maintaining a sufficient withstand voltage and capable of low cost production and utilizing EMC (epoxy molding compound)....
Hysol GR15F-MOD2C Hysol GR 15F-MOD2CAnhydride epoxies tend to stick quite a lot to the mold. It is common to use up to 10 shots of melamine to clean the molding compound residues. Visit our Cleaning and Conditioning category to find the ideal cleaning solution for your process.Leading...
Under the stimuli of reducing product weight and reducing cost through part consolidation, polymers have been replacing metals in many manufacturing operations. One of the newer polymer processes, reaction injection molding (RIM), has enjoyed a rapidly growing market, especially in automotive ...
combination with epoxy (7/3) for manufacturing mixed thermosetting powder coatings. Product Properties:Excellent mechanical properties,good flow and economy Specifications: Performance Specifications test method Appearance Colorless to light yellow flake ...