improved expoxyharz - formmasse to einkapseln of microelectronics components, after the transformation into a wrmegehrteten, i.e. unschmelzbaren state by application of heat and warmth of a small wMIYASHIRO, JAMES J., WOODSTOCK, ILL., USSHINOHARA, MAKOTO, CRYSTAL LAKE, ILL., US...
PURPOSE:An epoxy resin molding compound forming very little flash during transfer molding, which is prepd. by adding a barium or magnesium oxide powder to an epoxy resin composition compounded with a phenolic resin and a silica powder. CONSTITUTION:An epoxy resin such as a phenolic novolak epoxy...
Process Optimization of the Morphological Properties of Epoxy Resin Molding Compounds Using Response Surface Design An epoxy compound's polymer structure can be characterized by the glass transition temperature (Tg) which is often seen as the primary morphological charac... Vogelwaid, Julian,Bayer, ...
1) epoxy resin mold 环氧树脂塑模 2) Epoxy Molding Compound 环氧树脂塑封料 1. China epoxy molding compound market is relatively booming, and has been the major aim of vast leading manufacturers in this arena. 相应地,半导体封装用环氧树脂塑封料市场也以相同的速度急剧增长,众多的国际知名环氧树脂塑封...
(2) 硬化樹脂(HARDENERRESIN 用來與環氧樹脂交聯作用的硬化劑大致 可分三類: (1) 酸酐類(2)有機胺(3)酚樹脂,其受熱 硬化到達某一硬度和時間關係可決定 MOLDINGCYCLETIME(如圖一)。硬度以 蕭氏硬度表示,高的模溫COMPOUND較 快硬化,MOLDING時表面硬度不夠常造 成脫膜時膠體崩裂(CRACK)、缺角等不良 品,硬化劑...
EPOXY RESIN MOLDING COMPOUND FOR SEALING USE AND ELECTRONIC COMPONENT DEVICE PROBLEM TO BE SOLVED: To provide an epoxy resin molding compound for sealing use realizing high flame retardancy, excellent in moldability such as fluidity, and also exhibiting high resistance to resin deterioration at high ...
1 2 3 1 2 3 90 60 30 SHORE HARDNESS 圖(一) CURE CYCLE (MINUTE) 160℃ 180℃硬化樹脂 (HARDENER RESIN 用來與環氧樹脂交聯作用的硬化劑大致可分三類 : 酸酐類 (2)有機胺 (3)酚樹脂,其受熱硬化到達某一硬度和時間關係可決定 MOLDING CYCLE TIME(如圖一)。硬度以蕭氏硬度表示,高的模溫COMPOUND較快...
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EPOXY MOLDING COMPOUND 专利名称：EPOXY MOLDING COMPOUND 发明人：ALLEN, Richard Brian 申请号：EP82902030.0 申请日：19820517 公开号：EP0080499A1 公开日：19830608 专利内容由知识产权出版社提供 摘要： molding consists improves. This compound comprises: a) from 5 to 90% by weight of epoxy resin ...
6.Synthesis of Hexaphenylamine Cyclotriphosphazene Flame Retardant and Its Application in Epoxy Molding Compound for Large-scale Integrated Circuit Packaging六苯胺环三磷腈的制备及其对大规模集成电路封装用环氧模塑料的无卤阻燃 7.Preparation and Properties Study on Encapsulating Materials of Epoxy Resin;环氧树...