The organic additives, DPS, PEG, and DPS/PEG (2:1) influenced the electrochemical behavior of copper deposition, crystalline structure, resistivity, shape of plated Cu-studs, and grain size. The morphology of the copper films was examined by AFM and SEM. Deposition from DPS/PEG solution ...
The nanocomposite coatings composed of carbon nanotubes and various forms of copper were prepared in the two-step process. Firstly, carbon nanotubes were coated on stainless steel substrate using electrophoretic deposition at constant current. Then, the
electrochemical deposition of copper, a barrier layer of tantalum nitride/tantalum was formed, followed by physical vapor deposition of copper seed layer; gap fill metallization; reduction of copper oxide to copper; reducing gas selected from hydrogen, argon, nitrogen, ammonia and boronhydride US ...
The electrochemical deposition of copper in reduced polyaniline (PAN) films is studied at different polymer layer thicknesses. A saturation in the number density, n 0, of active sites for metal deposition is found at 0.5 μm PAN thickness ( n 0=10 8 cm 2). The surface spatial distribution...
FIELD: non-ferrous metallurgy, specifically, electrochemical deposition of copper for manufacture of quality articles for various branches of industry. SUBSTANCE: electrolyzer includes body of bath, anodes, cathodes, pipe-line system to feed electrolyte, pocket for waste electrolyte. Pipe-line system to...
depositing a copper less seed layer on the diffusion barrier effective for electrochemical deposition of gap fill copper. 在该扩散阻挡层上沉积无铜种晶层,其对空隙填充铜的直接的电化学沉积有效。 ip.com 3. A template-free electrochemical deposition method for preparations of ZnO nanorod array is repo...
FIELD OF INVENTION This invention relates to plating solutions for the chemical or electrochemical deposition of copper interconnects in semiconductor devices, to methods of using these plating solutions, and to copper methide salts. More particularly, this invention relates to electroless or electrolytic...
This paper presents a model to simulate the electroplating of copper in a microcavity typically found in the plating of copper onto circuit boards. We use COMSOL Multiphysics® simulation software to plot the thickness of the deposition along the vertical cathode boundaries, get the meshes of ...
In this paper we report on the deposition of copper on n-Si(111) from 1 mM CuSO4+0.1 M H2SO4 (pH=1) solution. Voltammograms revealed a deposition peak characteristic of diffusion limited growth. Atomic force microscopy (AFM) images after deposition of a few monolayers showed that deposition...
glasscarbonelectrodefrombothCuCI2 silicasolsandaqueoussolutionswereinvestigatedbyutilizingcyclicvoltammetryandchronoamperometry, respectively.Theexperimentresultsindicatedthatcopperelectrodepositioninvolvedthetwo-stepreactionin bothelectrolytes,andthedepositionratedeterminingstep(Cu reducedtoCu)insilicasolwaseasier thanthatin...