EIAJ ED-4702-SMD半导体零件的焊锡强度测试
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EIAJ ED-7300 “Basic items for specifications of outline of semiconductor packages” (5) The other terms are based on EIAJ ED-4701 “Environmental and endurance test methods for semiconductor devices”. 3. Normative References EIAJ ED-4701 “Environmental and endurance test methods for semiconductor ...
EIAJ ED-4702A 2003 Mechanical strength testing s.pdf 上传人:hon***an IP属地:江苏 文档编号:22359410 上传时间:2019-10-16 格式:PDF 页数:49 大小:451.15KB 举报 版权申诉word格式文档无特别注明外均可编辑修改;预览文档经过压缩,下载后原文更清晰!立即下载 配套...
EIAJ ED-4701-400半导体器件环境和耐久性试验方法.pdf,Standard of Japan Electronics and Information Technology Industries Association EIAJ ED-4701/400 Environmental and endurance test methods for semiconductor devices (Stress test II) Established in August,
It is specified as EIAJ ED-4702 “Mechanical stress test methods for semiconductor surface mounting devices“ in JEITA. (2) For difference with JEDEC JESD 22 B 105-B The test item in JEDEC standard is the same as this standard but, the test conditions is very different. The test ...