EIA-364-52A-2003
eia-364-52a page 2 2.1.3 dipping equipment contaminant weight, percent maximum copper 0.300 gold 0.200 cadmium 0.005 zinc 0.005 aluminum 0.006 antimony 0.500 solder dipping equipment or technique shall be mechanical or mechanical/electromechanical and capable of controlling the immersiodemersion rates, ...