Memory manufacturers must use very expensive advanced memory testers (like the one illustrated here) in order to fully certify the actual speed of the memory devices in accordance with the latest JEDEC DDR standards. These standards specify a large number of timing and current parameters that each ...
“Cadence’s paper explained how the integrated Integrity 3D-IC platform in conjunction with TSMC’s advanced 3DFabric technologies enable a system-level approach to product design to improve PPA and time to market,” said Suk Lee, vice president of the Design Infrastructure Management Division at ...
” Kingston explained. “Part of that work is done by the lens itself, and then there is a lot of software that works alongside the lens in order to recognise objects and improve the image. That software works
The effect is explained in (2). fo = resonant frequency (Hz) c = speed of light (1.18×1010 inches/sec) via_stub_length in inches Dkeff = effective dielectric constant The effect of via stub is analyzed with the simulation of insertion loss. With reference to the plot of insertion ...