原子百分比。cu6Sn5和cu3Sn都是金属间化合物,cu6Sn5是指铜锡按照六比五的比例融合而成,cu3sn是指铜锡按照三比一的比例融合而成。如果是混合物、化合物,比如铁碳合金,说的是质量百分比,也就是质量分数,纯金属是直接由原子构成的,说的是原子百分比。从化学角度上,cu6Sn5和cu3Sn都是原子百分比。 00分享举报...
cu6sn5和cu3sn中的化学符号：Sn念锡，Cu是铜，直接念作铜六锡五即可。IMC系Intermetallic compound 之缩写，笔者将之译为"介面合金共化物"。广义上说是指某些金属相互紧密接触之介面间，会产生一种原子迁移互动的行为，组成一层类似合金的"化合物"，并可写出分子式。在焊接领域的狭义上是指铜锡、金...
原子百分比。cu6Sn5和cu3Sn都是金属间化合物，cu6Sn5是指铜锡按照六比五的比例融合而成，cu3sn是指铜锡按照三比一的比例融合而成。如果是混合物、化合物，比如铁碳合金，说的是质量百分比，也就是质量分数，纯金属是直接由原子构成的，说的是原子百分比。从化学角度上，cu6Sn5和cu3Sn都是原子...
即是说,Cu3Sn是寄生在Cu6Sn5上,靠近铜基一侧的,与Cu6Sn5共同组成了锡铜焊点间的IMC。 由于Cu3Sn是一种脆性的金属间化合物,因此,当其厚度大于1.5微米(即IMC层总厚度大于4微米)以后,就会使焊点产生“脆性”,从而易发生断裂。从这个意义上来讲,我们...
Sn念锡，Cu是铜。高温态的Cu6Sn5和Cu3Sn都是密排六方结构，铜6锡5，金属间化合物，指铜锡按照六比五的比例融合而成。cu3sn是指铜锡按照三比一的比例融合而成。
The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces,while Cu–Zn compound layers are formed in the Sn–Zn/Cu system.Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed.Creep and fatigue phenomena are also reviewed.In ma...
Moreover, the scratch rate does not have a significant effect on the nanotribological characteristics except for those of Cu 6Sn 5 and Cu 3Sn under a normal load of 10 mN. Though the hardness of Cu 6Sn 5, Cu 3Sn, and Ni 3Sn 4 is similar, Ni 3Sn 4 appears to be more prone ...
The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces,while Cu–Zn compound layers are formed in the Sn–Zn/Cu system.Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed.Creep and fatigue phenomena are also reviewed.In ma...
铜、锡的离子半径近似相等，可视为等大球最紧密堆积。结论来了：凡是等大球最紧密堆积，就有N个八面...
We report in this paper Young's moduli and hardness of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared by annealing Sn-Cu and Sn-Ni diffusion couples. Indentations performed along the directions lateral and perpendicular to the ...