Phase Diagrams and Physical Properties of Nonequilibrium AlloysNonequilibrium Phase Diagrams of Ternary Amorphous AlloysSummary This document is part of Subvolume A 'Nonequilibrium Phase Diagrams of Ternary Amorphous Alloys' of Volume 37 'Phase Diagrams and Physical Properties of Nonequilibrium Alloys' ...
Melting temperatures of Sn–Ag–Cu (SAC) alloys in the Sn-rich corner are of interest for lead-free soldering. At the same time, nanoparticle solders with depressed melting temperatures close to the Sn–Pb eutectic temperature have received increasing attention. Recently, the phase stability of ...
The 15th National Conference of Phase Diagrams of China and Multilateral Symposium 011 Phase Diagrams and Materials Design Cu.Sn二元系统相图的第一性原理研究 周伟,穆文凯,刘卫芳,刘立娟,吴萍 (天津大学理学院物理系,天津300072) 摘要:Sn基合金是目前微电子封装领域使用的的主要材料,但目前对于二元Cu-Sn系统研...
合金的物性参数由纯 Cu 和 Sn 的物 图 1 Cu-Sn 合金二元平衡相图 性参数[14]拟合而成。理论计算所用物性参数如表 1 所 Fig.1 Phase diagram of Cu-Sn binary alloy 第 17 卷第 9 期 杨 扬,等: 急冷条件下 Cu-Sn 合金的快速枝晶生长 1523 列。计算获得的冷却速率与辊速的关系如图 2 所示。 从...
Thermodynamic description of the Cu-Pb-Sn system at the Cu-Pb side Based on the critically reviewed experimental data available in the literature, new phase transition temperatures and phase equilibria at 800℃ close to th... J Miettinen,P Docheva,G Vassilev - Calphad-computer Coupling of Phase...
用新一代几何模型和其它几何模型,计算了液态合金Zn-Cu-Sb的过剩混合自由能及Zn-Ga-In-Sn的混合焓.结果表明,新一代几何模型的应用更为可靠合理. 刘勇华,李福燊,李丽芬,... - 全国相图学术会议 被引量: 0发表: 0年 Al-Zn(Cu)合金的相变和Al-Zn-Cu系相图 The room temperature phase diagram of Al-Zn-...
基于CALPHAD(CALculation of PHAse Diagram)方法建立多元热力学数据库,结合显微组织表征,性能测定和强化机制的计算,可以进一步研究Ag或Ti的添加对Cu-Cr-Zr合金时效过程中结构演变的热力学和动力学.本工作以Cu-Cr-Zr(-Ag/Ti)体系为研究对象,主要创新研究成果如下:(1)结合文献报道重新评估了Cr-Ag二元系的热力学参数,...
Resolving the phase diagram has been difficult because of several problems. One problem is that titanium is very reactive with oxygen, so there are very few liquidus data for high Ti contents at high temperatures. Another problem is that the Ti2Cu and Ti3Cu phases have very similar XRD pattern...
Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints Thermomigration in Pb-free SnAg solder alloys is investigated during accelerated electromigration tests under 9.7 × 103A/cm2at 150 °C. It is found that C... HY Chen,C Chen - 《...
目前所研究的无铅钎料体系中,Sn.Ag.Cu系合金钎料以其优良的综合 性能被认为是最有发展前途的Sn.Pb钎料的替代品。本文通过分析Ag、Cu 含量对钎料基础焊接性能影响,选择Sn.3.0Ag.0.5Cu作为研究对象,添加 微量第四组元Ni,分析测试了Ni对合金钎料熔化特性、润湿性、力学性 ...