PURPOSE: A slurry supply system of semiconductor CMP(chemical mechanical polishing) equipment is provided to prevent a wafer from being scratched. CONSTITUTION: A slurry supply system of semiconductor CMP equipment comprises a slurry drum(10,110) storage for storing the drums of slurry, a slurry ...
drum recirculation with a positive displacement pump (e.g., bellows pump operated at 3 gpm for 10 minute every 4 hours) or periodic mechanical mixing at 1200 rpm (5 minutes every 4 hours) prior to slurry blending should be adequate to maintain good particle suspension in the on-line drum....
Shifts in the pH and dehydration can both cause particle agglomeration in the slurry. A chiller and stainless steel coil were used to maintain the slurry at 20 卤 2掳C during the test. Fresh slurry from the same drum was used in each test and ...
drum recirculation with a positive displacement pump (e.g., bellows pump operated at 3 gpm for 10 minute every 4 hours) or periodic mechanical mixing at 1200 rpm (5 minutes every 4 hours) prior to slurry blending should be adequate to maintain good particle suspension in the on-line drum....
PURPOSE: A slurry supply system of semiconductor CMP(chemical mechanical polishing) equipment is provided to prevent a wafer from being scratched. CONSTITUTION: A slurry supply system of semiconductor CMP equipment comprises a slurry drum(10,110) storage for storing the drums of slurry, a slurry ...