PROBLEM TO BE SOLVED: To provide a CMOS image sensor sensing red, green and blue lights easily by varying a back bias voltage being applied to a semiconductor substrate without using a color filter layer thereby varying the width of depletion region of a photodiode, and to minimize the ...
CMOS Image Sensor
cmos图像传感器改善灵敏度的工艺研究 图 1 CIS 主要工作原理 化电路（Analog to Digital Converter，ADC）转换 成数字信号，并输出。2.2 CMOS 图像传感器光路结构 入射光透过微透镜、彩色滤镜和介质层到达硅 片表面并被吸收，吸收的光子再转化为电子信号。叶红波，上海集成电路研发中心测试技术部，研究方向：集成电路...
CCD and CMOS image sensors each have strengths and weaknesses coming from their architecture or their fabrication process.The comparisons of their detectio... M Song,XK Gui,YR Zheng - 《Semiconductor Optoelectronics》 被引量: 90发表: 2005年 A CMOS Image Sensor Integrated with Plasmonic Colour Fil...
CCD and CMOS image sensors each have strengths and weaknesses coming from their architecture or their fabrication process.The comparisons of their detectio... M Song,XK Gui,YR Zheng - 《Semiconductor Optoelectronics》 被引量: 90发表: 2005年 Stacked pixel for high resolution CMOS image sensor Prov...
Abstract — Wafer level chip scale package play an important role in the fabrication of CMOS image sensor, which could reduce the cost and decrease the chip size. But the yield of WLCSP suffers from the bonding process between sealing glass and wafer substrate. In order to improve the package...
CCD and CMOS image sensors each have strengths and weaknesses coming from their architecture or their fabrication process.The comparisons of their detectio... M Song,XK Gui,YR Zheng - 《Semiconductor Optoelectronics》 被引量: 90发表: 2005年 A CMOS Image Sensor Integrated with Plasmonic Colour Fil...
CCD and CMOS image sensors each have strengths and weaknesses coming from their architecture or their fabrication process.The comparisons of their detectio... M Song,XK Gui,YR Zheng - 《Semiconductor Optoelectronics》 被引量: 90发表: 2005年 A CMOS Image Sensor Integrated with Plasmonic Colour Fil...
A CMOS image sensor is provided to fabricate a high-capability photodiode without an attack of a subsequent process by performing a photodiode process separately from a transistor fabricating process and a capacitor fabrication process. A photodiode cell(111) without a micro lens is formed in a ...
Flip-chip image sensor packages and methods of fabrication Flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an im.....