Chip-to-chip interconnection, based on wireless communication by capacitive coupling was investigated. This innovative approach will considerably reduce the pitch of the pin and strongly help in the implementation of a dense network of interconnects, while improving inter-chip bandwidth and power ...
We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impe...
Point-to-point protocolLow latencyHigh bandwidthFPGA prototypeMulti-chip architectures have been a focal point not only in high-performance computing but also in the new generation of embedded systems. For point-to-point topology, high latency and low bandwidth are always found in existing chip-to...
The term interconnection has traditionally implied a 'robust' connection from a transistor or a group of transistors in an IC to the outside world, usually... Bartelink,J Dirk - American Institute of Physics 被引量: 1发表: 1998年 Chip-to-chip interconnections for very high-speed system-leve...
- Micro-& Nano-optics for Optical Interconnection & Information Processing 被引量: 14发表: 2001年 Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is ...
December 28, 2015 -- Mn_nH release X2X AXI interconnection IP for chip to chip communication. X2X AXI chip to chip interface IP enable equivalent AXI functionality and performance but less I/O usage with raising the rate of utilisation of AXI signal. And X2X IP provide system to system, ...
6, 2012 — A new integrated laser device that serves as the basis for chip-to-chip interconnection could surpass the capabilities of CMOS technology, according to Odis Inc., a US affiliate of OPEL Technologies Inc. The vertical cavity laser (VCL) by Odis fuses optical and electronic devices...
16.The method of claim 11, wherein forming electrical interconnection includes arranging a bridge component on the top surfaces of the first and second IC dice prior to covering the top surfaces of the first and second IC dice with the non-conductive material, wherein the bridge component inclu...
The drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 104leads per cm2), compliant, wafer-level, input/output interconnection technol...
ICT-STREAMS is a European research project that aims to combine WDM parallel on-board transceivers with a cyclical AWGR, in order to create a new board-level, chip-to-chip interconnection paradigm that will leverage WDM parallel transmission to a powerful wavelength routing platform capable to ...